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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Process Development Engineer - Chemical Mechanical Planarization

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A PhD with at least 5 years, a Master's degree with at least 7 years, or a Bachelor's degree with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field is required.
  • Demonstrated experience in CMP process development for advanced semiconductor or memory technologies, including leadership of complex technical projects and cross-functional delivery.
  • Hands-on experience with leading-edge CMP polishing equipment, such as EBARA WS or Applied Materials platforms.
  • Deep expertise in CMP process development, including dielectric and metal polishing mechanisms, slurry, pad, conditioning, equipment operation, and process optimization for advanced nodes.
  • Strong understanding of NAND or memory process integration and the structural impacts of film deposition and CMP interactions.
  • Proficiency in Design of Experiments, root-cause analysis, statistical and experimental data interpretation, and data analytics tools such as Y3.
  • Ability to develop process monitoring and control strategies and apply data-driven methods to improve yield, process margin, robustness, and manufacturability.
  • Experience evaluating CMP consumables, equipment, hardware, and supplier solutions for technology development and high-volume manufacturing readiness.
  • Ability to drive alignment and execution across global, cross-site, and cross-functional teams through technical influence.
  • Ability to communicate technical information clearly and structurally, including documentation, stakeholder updates, and recommendations for high-impact decisions.
  • Ability to mentor and coach junior engineers and strengthen technical standards.
  • Ability to prioritize and execute projects across multiple concurrent technology development initiatives.

Responsibilities

  • Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes.
  • Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance.
  • Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements.
  • Transfer developed CMP processes to high-volume manufacturing at Fab 10N and lead cross-functional actions supporting ramp readiness and continuous improvement.
  • Collaborate with Process Development, Process Integration, manufacturing, equipment, global development teams, and suppliers to align CMP solutions with NAND technology requirements.
  • Lead evaluations of consumables, equipment, hardware, and novel applications to close process capability gaps and enable future-node requirements.
  • Resolve complex process, yield, defectivity, and integration challenges using structured root-cause analysis and data-driven decision-making.
  • Develop and deploy advanced process monitoring and control methodologies to support stable and repeatable manufacturing performance.
  • Drive process simplification and manufacturing optimization opportunities that improve cost, productivity, and cycle time.
  • Lead complex cross-functional projects, communicate technical status and risks, and influence execution outcomes across sites and stakeholders.
  • Mentor junior CMP engineers and strengthen technical rigor, documentation, knowledge sharing, and engineering standards.
  • Engage internal partners and external suppliers to advance innovation while complying with intellectual property and data protection requirements.
  • Contribute to technical documentation and intellectual property generation, including patents and technical papers, where applicable.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, using sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work to support continuous improvement.

Desired Qualifications

  • Experience transferring advanced CMP processes from technology development to high-volume manufacturing.
  • A record of technical contributions through patents, technical papers, internal standards, or supplier-enabled innovation.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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