Manufacturing Technical Program Manager
AttoTude
Manufacturing Technical Program Manager
AttoTude
Photonic interconnects powering AI data centers
About AttoTude, The World's First THz Radio Over Wire
AttoTude is at the forefront of revolutionizing data centers through advanced interconnect technology based on wired THz transceivers. By adapting the fiber from photonics and advancing today's ASICs to THz, our innovative AttoEngine eliminates networking bottlenecks, enabling high-speed interconnects for AI data centers.
Job Summary
The Manufacturing Technical Program Manager (MFG TPM) leads the development, industrialization, and execution of advanced manufacturing technologies spanning wafer fabrication, innovative wire solutions, and precision alignment/assembly processes. The role owns technical program strategy, readiness milestones, and execution cadence to mature new technologies from early development through high-volume production.
Serving as a technical bridge across R&D, wafer fabs, OSATs, Manufacturing Engineering, and CMs, the MFG TPM ensures alignment between design intent, process capability, yield, and manufacturing readiness across globally distributed teams. The role combines strong wafer-fab technical understanding with disciplined program leadership and hands-on problem solving to support advanced datacenter hardware platforms.
Key Responsibilities
Required Qualifications
Preferred Qualifications
Key Competencies
AttoTude is an equal opportunity employer. We’re committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic.
AttoTude designs and sells advanced interconnect technology for data centers, focusing on AI workloads. Its main products are photonic interconnect solutions built on photonic integrated circuits and optical communications that move data at very high speeds with low bottlenecks. These interconnects connect servers, switches, and storage to enable high-speed parallel processing and supercomputing, reducing latency and increasing bandwidth in large-scale deployments. The company differentiates itself by concentrating on photonics-based networking to address AI-specific data center bottlenecks, serving large operators and enterprises through direct sales and licensing. Its goal is to help data centers scale AI capabilities efficiently by providing reliable, high-performance interconnects that support demanding workloads and future growth.
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