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Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Wire Bond Process & Equipment Senior/Staff Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSeremban, Negeri Sembilan, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
  • A minimum of 5–8 years of experience in wire bonding equipment and semiconductor process engineering.
  • Strong understanding of thermosonic and ultrasonic wire bonding techniques for gold and copper; handling other wire types is a plus.
  • Hands-on experience with ASM wire bonders, bonder programming, and process optimization.
  • Analytical and problem-solving ability, with experience using data to drive decisions.
  • Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
  • Statistical knowledge or hands-on experience with JMP, Minitab, or other statistical tools.
  • Ability to communicate and collaborate across teams.

Responsibilities

  • Lead the setup, qualification, and optimization of wire bonding equipment and processes, including CZ and DOE activities.
  • Drive continuous process improvements to enhance yield, reliability, and throughput.
  • Troubleshoot and resolve equipment- and process-related issues in a high-volume manufacturing environment.
  • Perform disposition of non-conforming materials and implement corrective and preventive actions.
  • Collaborate with design, quality, and manufacturing teams to support new product introductions.
  • Analyze process data, identify trends, and implement data-driven improvements.
  • Mentor and guide junior engineers and promote knowledge sharing and best practices.
  • Ensure compliance with safety, quality, and environmental standards.
  • Develop and maintain documentation such as FMEA, Control Plans, OCAP, and SPC.
  • Support internal and external audits.
  • Lead cost-reduction and Manufacturing Value Add improvement projects.
  • Perform additional tasks as assigned by management.

Desired Qualifications

  • Hands-on experience with KNS wire bonders.
  • Experience handling wire types other than gold and copper.

About the Company

Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.

Company size
1,001-5,000
Company stage
Acquired
Total funding
$880M
Headquarters
Nijmegen, Netherlands
Founded
1953

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