Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.
Company Size
51-200
Company Stage
Series A
Total Funding
$35M
Headquarters
Milpitas, California
Founded
2015
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