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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Principal Package Design Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-time

About the Job

Requirements

  • A master's or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field is required.
  • At least 5 years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration is required.
  • Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as applied to AI infrastructure and data center power management is required.
  • Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive hands-on experience with model setup, simulations, and analysis is required.
  • A strong background in computer-aided design and simulation tools is required.
  • Experience with package reliability testing and qualification standards is required.
  • Experience working with outsourced semiconductor assembly and test providers, substrate vendors, assembly houses, and semiconductor supply chains is required.
  • Proven ability to troubleshoot packaging failures and drive root cause and corrective action is required.
  • Strong project leadership and cross-functional communication skills are required.

Responsibilities

  • Lead the design, development, and qualification of advanced semiconductor packaging solutions, including flip-chip, chip embedding, wafer-level packaging, fan-out wafer-level packaging, panel-level packaging, 2.5D/3D packaging, system-in-package, ball grid array/chip-scale package, and wafer-to-wafer and die-to-wafer heterogeneous bonding.
  • Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements, using hands-on simulation expertise.
  • Drive package technology and outsourced semiconductor assembly and test selection and development for new product introductions.
  • Work with integrated circuit design, product definition, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.
  • Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
  • Perform and guide simulations and analysis related to signal integrity and power integrity, thermal performance, mechanical stress and warpage, and design for manufacturability.
  • Develop assembly flows and process requirements for outsourced semiconductor assembly and test providers and manufacturing partners.
  • Lead package qualification activities, including design of experiments planning, failure analysis, and reliability testing.
  • Resolve packaging-related issues during new product introduction prototype builds, qualification, and production ramp.
  • Collaborate with suppliers and internal and external manufacturing partners on process improvements, material evaluation, and yield optimization.
  • Create and maintain package specifications, design rules, process documentation, and technical reports.
  • Mentor junior engineers and provide technical leadership across packaging initiatives.
  • Deliver robust package solutions that meet performance, reliability, and cost targets.
  • Enable product transfer from concept through development to manufacturing.
  • Reduce packaging risks through technical analysis, hands-on simulations, and qualification planning.
  • Improve yield, quality, and manufacturability through collaboration with internal and external partners.

Desired Qualifications

  • Experience with power semiconductor devices and packaging, including silicon, silicon carbide, and gallium nitride MOSFETs, power modules, and intelligent power modules, and their applications in consumer, industrial, automotive, and high-performance computing markets.
  • Experience with power products in high-performance computing, artificial intelligence and machine learning hardware, or mobile products.
  • Hands-on experience with package design and simulation tools such as Cadence Allegro Package Designer, SolidWorks, ANSYS, COMSOL, JMP, or Minitab.
  • Knowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.
  • Experience in wafer-to-wafer, die-to-wafer, die-to-die 3D heterogeneous integration, and chiplet-based packaging.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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