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Hewlett Packard Enterprise

Builds servers, networking and private cloud

Senior Principal Mechanical Engineer

Design EngineeringConfirmed live in the last 24 hours
Full-timeSunnyvale, CA, USA

About the Job

Requirements

  • A Bachelor of Science degree in Mechanical Engineering or equivalent is required.
  • At least 12 years of experience in electromechanical product development is required.
  • A Master of Science degree in Mechanical Engineering or equivalent is preferred.
  • Experience developing networking, server, storage, telecommunications, or high-performance computing systems is preferred.
  • Extensive experience with chassis development, system packaging, and high-density electronic assemblies is preferred.
  • Experience with advanced cooling technologies, including liquid cooling solutions, is preferred.
  • Demonstrated leadership of complex cross-functional development programs is preferred.
  • Expert-level proficiency with 3D solid modeling tools is required; SolidWorks experience is preferred. Working knowledge of EPDM or equivalent product lifecycle management systems is a plus.
  • Extensive experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products is required.
  • Strong hands-on experience with tolerance analysis, geometric dimensioning and tolerancing (GD&T), stack-up analysis, and structural analysis techniques is required.
  • Working knowledge of finite element analysis (FEA) and interpretation of simulation results is required.
  • Experience with ECAD-MCAD integration and IDF workflows is required.
  • Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes is required.
  • Strong understanding of tooling requirements and manufacturing considerations for volume production is required.
  • Working knowledge of thermal design principles, thermal characterization, and advanced cooling technologies, including liquid cooling, is required.
  • Strong understanding of NEBS, EMI, EMC, safety, and other regulatory compliance requirements is required.
  • Proven ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments is required.
  • Experience leading root-cause investigations and implementing corrective actions is required.
  • Strong understanding of product cost drivers, tooling investments, supplier capabilities, and budget management is required.
  • Ability to influence cross-functional teams through communication and leadership is required.
  • Comprehensive understanding of the complete product development lifecycle from concept through production and field support is required.

Responsibilities

  • Lead mechanical development of complex networking systems and chassis platforms from concept through production release and field support.
  • Provide technical leadership across multiple programs and serve as a subject matter expert for mechanical architecture, packaging, manufacturability, reliability, and serviceability.
  • Evaluate and integrate new technologies in cooling, liquid cooling, interconnects, materials, and manufacturing processes to support future product roadmaps.
  • Drive system-level technical decisions, balancing performance, cost, schedule, reliability, manufacturability, compliance, and customer requirements.
  • Participate hands-on in engineering activities, including CAD reviews, tolerance analysis, prototype evaluation, laboratory testing, failure analysis, and root-cause investigations.
  • Lead cross-functional design reviews and collaborate with Electrical, Thermal, Signal Integrity, Reliability, Manufacturing, Operations, and Supply Chain teams.
  • Drive technical content of system specifications, design guidelines, validation plans, and engineering standards.
  • Develop and maintain mechanical design standards, best practices, and engineering methodologies across the organization.
  • Identify technical risks and drive mitigation plans throughout the product development lifecycle.
  • Support customer escalations, manufacturing issues, and field failures through hands-on troubleshooting and corrective action development.
  • Lead supplier engagements involving design reviews, manufacturing readiness, tooling strategies, and technical issue resolution.
  • Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.
  • Mentor and develop engineers through technical coaching, design reviews, and day-to-day engineering leadership.
  • Contribute to long-term technology planning and future platform development initiatives.

Desired Qualifications

  • SolidWorks experience.
  • Working knowledge of EPDM or equivalent product lifecycle management systems.
  • Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
  • Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
  • Experience with advanced cooling technologies, including liquid cooling solutions.
  • Demonstrated leadership of complex cross-functional development programs.

About the Company

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company size
10,001+
Company stage
IPO
Headquarters
Houston, TX
Founded
1939

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