R&D Manager

We are seeking an experienced R&D Manager to lead the development of advanced semiconductor packaging solutions, with a focus on ultrasonic actuator technology, precision motion systems, and innovative mechatronic products. The successful candidate will manage engineering projects and teams, drive technology innovation, and collaborate closely with global R&D, manufacturing, and product teams to deliver high-performance products from concept to commercialization.

Key Responsibilities

Research & Development

• Lead the research, design, and development of advanced technologies to be applied in semiconductor packaging equipment.

• Develop, optimize, and design mechatronic precision system in Sub micron level

• Familiar with motion control is preferred.

• Conduct engineering simulations, performance analysis, and verification testing to achieve product performance and reliability objectives.

Project Management

• Plan, manage, and monitor R&D projects to ensure timely delivery, budget control, and achievement of technical milestones.

• Coordinate resources and priorities across multiple development projects.

• Prepare project updates, technical reports, and development roadmaps for management review.

Product Industrialization & Manufacturing Support

• Work closely with manufacturing teams to facilitate new product introduction (NPI) and technology transfer.

• Drive yield improvement, process optimization, cost reduction, and quality enhancement initiatives.

• Develop standardized production processes and engineering documentation to support mass production.

Cross-Functional Collaboration

• Collaborate with global R&D teams, suppliers, and external partners on technology development projects.

• Provide technical expertise and problem-solving support for production, quality, operations, and customer-facing teams.

• Partner with product management to translate market requirements into technical solutions.

Innovation & Intellectual Property

• Contribute to the development of proprietary technologies and intellectual property.

• Support patent filing activities and technology innovation initiatives.

• Monitor industry trends and emerging technologies within semiconductor packaging and precision engineering.