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AMD

Designs chips for computers and AI systems

Data Center System Interconnect Engineer

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeAustin, TX, USANo salary listedIn-person

About the Job

Requirements

  • Proven experience in high-speed interconnect technologies for data center systems, including blind-mate connectors, cables, and sockets.
  • Knowledge of optical connectors for datacenters.
  • Expertise in mechanical tolerance analysis (RSS/Monte Carlo) and connector reliability standards.
  • Hands-on experience with signal integrity principles, VNA measurements, and failure analysis of separable interfaces and solder joints.
  • Familiarity with contact metallurgy, plating finishes, and root cause analysis for interconnect failures.
  • Strong program leadership skills with experience managing supplier development and qualification.
  • Proficiency in CAD tools (AutoCAD, SolidWorks), simulation tools (LabVIEW, MATLAB, JMP), and structural FEA is a plus.
  • Excellent communication skills for technical documentation and executive presentations.
  • An MS in Mechanical, Electrical, Materials, or Systems Engineering is required.

Responsibilities

  • Own end-to-end development of high-speed interconnect components—connectors, cables, and sockets—optimized for data center platforms and rack-scale deployments.
  • Architect advanced interconnect solutions for emerging packaging technologies, multi-node systems, and high-density racks, influencing platform-level design decisions.
  • Lead performance validation through signal integrity analysis, mechanical reliability testing, and compliance with industry standards for high-speed data transmission.
  • Develop and qualify interconnect ecosystems, including test boards, fixtures, and evaluation methodologies, to ensure readiness for high-volume manufacturing.
  • Manage multi-supplier programs to accelerate innovation and maintain a robust supply chain for critical interconnect technologies.
  • Collaborate cross-functionally with packaging, board, and system teams to optimize interconnect performance across electrical, mechanical, and thermal domains.
  • Create and maintain technical documentation, including specifications, bills of materials, and assembly guidelines for manufacturing and quality assurance.
  • Drive continuous improvement by mentoring teams, fostering innovation, and advancing AMD’s interconnect technology roadmap.

Desired Qualifications

  • A Ph.D. in Mechanical, Electrical, Materials, or Systems Engineering is preferred.

About the Company

AMD

Designs chips for computers and AI systems

AMD designs processors, graphics chips and AI accelerators for computer makers, cloud operators and businesses that build electronic devices. Its Ryzen processors power personal computers, while EPYC processors handle work in data centers and Radeon chips render graphics. Instinct accelerators run AI models, paired with software that developers use to train models and put them into production. AMD sells chips and related computing systems through equipment makers, distributors and retail channels, and contracts with outside foundries to fabricate its semiconductor designs. It was founded in 1969 and has its headquarters in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1969

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