M

Micron Technology

Makes memory and storage chips for AI and PCs

Design Lead - HBM/Advanced Memory Design

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related field.
  • 20+ years of semiconductor design experience, adjusted per internal leveling guidelines.
  • Demonstrated experience leading complex integrated circuit development programs.
  • Strong understanding of digital and/or custom circuit design methodologies.
  • Experience with RTL design using Verilog/SystemVerilog.
  • Experience with timing closure and physical implementation concepts.
  • Experience with verification and debug flows.
  • Experience with DFT and silicon validation.
  • Experience with power, performance, and area optimization.
  • Strong communication, leadership, and project management skills.

Responsibilities

  • Lead the design and execution of complex memory subsystems and top-level integration activities.
  • Own design planning, technical decision-making, risk assessment, and schedule execution.
  • Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability.
  • Review design specifications, microarchitecture documents, and implementation plans.
  • Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities as project needs require.
  • Lead design reviews and drive issue resolution across organizations.
  • Mentor less-experienced engineers and provide technical leadership to project teams.
  • Define and improve compose methodologies using AI-enabled tools, automation, and protocols.
  • Support silicon bring-up, debug, characterization, and yield improvement activities.
  • Communicate project status, risks, and mitigation plans to management and collaborators.
  • Provide technical ownership of major product work, lead without direct authority across multiple organizations, influence architecture and technology decisions, mentor and develop engineering talent, and drive execution excellence and accountability.

Desired Qualifications

  • Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
  • Experience leading global multi-functional teams.
  • Knowledge of advanced process nodes and design-for-manufacturing concepts.
  • Experience with Synopsys and Cadence implementation flows.
  • Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.
  • Strong track record of successful product tape-outs.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs