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Micron Technology

Makes memory and storage chips for AI and PCs

Senior Engineer - APTD Dry Etch Process

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • At least 4 years of experience in the semiconductor-related industry.
  • A master's degree or above in Chemistry, Physics, Materials, or related engineering science fields; a PhD is a plus.
  • Experience with a dry etch process for silicon or dielectric structures.
  • Innovative and able to think independently.
  • Fluent communication in both English and Chinese.

Responsibilities

  • Drive HBM process development and yield improvement in the dry etch process.
  • Assist research and development for advanced package technology, including chip stacking, 2.5D, or 3D.
  • Support project on-site execution and make decisions as a technical consultant.
  • Troubleshoot complex problems, perform root cause analysis, and resolve process engineering issues.
  • Generate internal and external documentation for presentations and technical reports.
  • Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.
  • Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization.
  • Coordinate mechanical characterization and testing for advanced packaging development efforts globally, including US, Japan, and Singapore sites.
  • Provide recommendations for test structure and test vehicle design for material property evaluation.
  • Review, summarize, and present data with recommendations of materials, and lead discussions with packaging material suppliers to meet technical specifications and roadmaps.

Desired Qualifications

  • A PhD is a plus.
  • On-hand experience with TSV or plasma dicing.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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