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Micron Technology

Makes memory and storage chips for AI and PCs

DRAM Device & Process Integration Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A PhD or MS degree in Electrical Engineering, Physics, Materials Science, or a related technical field, plus demonstrated semiconductor industry experience.
  • Experience in semiconductor process integration or process development, including module ownership, integration trade-offs, and silicon-based problem solving.
  • Working knowledge of semiconductor device physics.
  • Hands-on experience with at least one process/device modeling or simulation tool (TCAD, Silvaco, Sentaurus, or comparable) applied to real process or device problems.
  • Experience correlating simulation or analytical results with experimental or silicon data.
  • Proficiency with data analysis, design of experiments (DOE), and statistical techniques.

Responsibilities

  • Own process integration for assigned DRAM front-end-of-line modules: define integration schemes, drive unit process and module interactions, and deliver on technology node milestones.
  • Design and execute design of experiments on silicon, analyze inline, parametric, and yield data, and drive root cause to resolution.
  • Apply device and process modeling (TCAD, Silvaco, Sentaurus, or comparable) to evaluate process interactions, device behavior, and scaling options, and to prioritize experiments before committing silicon.
  • Correlate simulation results with experimental and silicon data to improve model accuracy and deepen process understanding.
  • Work cross-functionally with Process Development, Device Engineering, Yield Enhancement, Electrical and Physical Failure Analysis, Parametric, Manufacturing, and Quality teams to identify and resolve issues.
  • Summarize complex technical problems, develop actionable recommendations, and build consensus across teams to drive solutions.
  • Define and achieve sub-milestones within larger technology development programs and support successful transfer from R&D into manufacturing.

Desired Qualifications

  • A PhD in Electrical Engineering, Physics, Materials Science, or a related technical field.
  • Memory, logic, analog, radio frequency, power, sensor, micro-electro-mechanical systems, or advanced-node integration experience.
  • Experience developing or calibrating predictive process/device models to support an integration or technology development team.
  • Experience taking a technology from R&D through manufacturing transfer.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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