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Rambus

Licenses high-speed chip-to-chip connectivity IP

PE Signal Integrity

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, India

About the Job

Requirements

  • A Bachelor of Engineering, Master of Science, or Master of Technology in Electrical Engineering is required.
  • At least 10 years of industry experience is required.
  • A solid background in signal integrity, power integrity, and package design is required.
  • Prior experience simulating high-speed memory interfaces such as DDR4 or DDR5, and/or SERDES interfaces, is required.
  • A strong theoretical background and understanding of electromagnetics and transmission-line theory is required.
  • A strong background and solid understanding of equalization techniques such as FIR, FFE, DFE, and CTLE are required.
  • The candidate must understand package and printed circuit board design and be able to use APD/Allegro layout files.
  • Experience correlating simulation results with lab measurements using oscilloscopes, TDRs, and VNAs is required.
  • Proficiency with Spice and ADS simulations is required.
  • Experience with commercial EDA tools such as HFSS, Q3D, or equivalent tools is required.
  • The candidate must be able to manage and drive projects independently.

Responsibilities

  • Create signal-integrity and power-integrity methodologies and work with design and chip-layout teams on SI/PI studies and package design for the latest DDR product portfolio.
  • Work with package and validation teams to define specifications and system-design requirements, including packaging and PCB routing, IC-PKG-BRD decoupling requirements, channel simulations, and jitter-sensitivity analysis.
  • Provide guidelines based on SI/PI studies, simulation, and silicon correlation to help ensure superior signal-integrity performance in products.
  • Collaborate with customers to identify optimal SI/PI solutions.
  • Assist the team with debugging and lab bring-up as needed.

Desired Qualifications

  • Exposure to on-die PDN design is a plus.
  • A strong understanding of server systems, from CPUs to DRAMs on DIMM modules, is highly desirable.
  • Familiarity with RedHawk/Totem or XcitePI is a strong plus.

About the Company

Rambus

Licenses high-speed chip-to-chip connectivity IP

Rambus designs, develops, and licenses high-speed chip-to-chip connectivity technology. Its IP powers data center servers, AI accelerators, and automotive systems, and is licensed to other semiconductor companies rather than manufactured and sold directly. The products are high-speed interfaces and security features embedded in chips, enabling fast, reliable communication between components. Rambus differentiates itself through a licensing-based model focused on advanced IP for memory, security, and high-speed interfaces across data centers, AI, and automotive markets, rather than relying on a traditional product lineup. The company’s goal is to enable high-performance chip communication at scale by monetizing its intellectual property through licensing and expanding into growing markets like data centers, AI, and automotive.

Company size
1,001-5,000
Company stage
IPO
Headquarters
San Jose, CA
Founded
1990

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