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FormFactor

Produces probe cards and test systems

Senior Manager - RF Design

Engineering LeadershipPosted on Nov 13
Full-timeFlorida, USA

About the Job

Requirements

  • A minimum of 8 years of experience in semiconductor test, RF product development, probe cards, advanced interconnect technologies, microelectronics, PCB design, or related industries is required.
  • A minimum of 3 years of engineering leadership, technical leadership, or people management experience is required.
  • A Bachelor's degree in Electrical Engineering, Physics, or a related engineering discipline is preferred.
  • A minimum of 10 years of related experience with a Bachelor's degree, 8 years with a Master's degree, or 5 years with a PhD, or equivalent work experience, is required.
  • Strong understanding of RF, microwave, and high-speed electrical design principles is required.
  • Experience with RF probe cards, RF interposers, test interfaces, substrates, or related semiconductor test hardware is required.
  • Understanding of PCB, thin-film, ceramic, and advanced substrate technologies, and SMT manufacturing processes, is required.
  • Demonstrated experience developing and implementing engineering design methodologies, standards, and best practices is required.
  • Experience driving design automation and design productivity improvements is required.
  • Working knowledge of DFMEA, PFMEA, Ishikawa, IS/IS NOT, root-cause analysis, and corrective action methodologies is required.
  • Familiarity with Lean Manufacturing, Six Sigma, DOE, SPC, and Gage R&R principles is required.
  • Problem-solving and decision-making skills are required.
  • Written and verbal communication skills are required.
  • Experience managing technical professionals and building high-performing teams is preferred.
  • Experience in semiconductor wafer probe, RF test systems, or advanced packaging technologies is preferred.
  • Experience leading global engineering teams and cross-site development activities is preferred.
  • Demonstrated success leading cross-functional development projects from concept through production release is preferred.

Responsibilities

  • Lead, coach, and develop a team of RF Probe Card Designers.
  • Establish team goals, performance expectations, and individual development plans.
  • Recruit, hire, mentor, and retain technical talent.
  • Foster a culture of accountability, accuracy, innovation, continuous improvement, and collaboration.
  • Develop succession plans and support career growth opportunities for team members.
  • Direct the production design of RF and microwave probe card solutions.
  • Provide technical leadership for the design of complex RF probe card architectures, transmission line structures, and probe technologies.
  • Evaluate and improve RF probe card design methodologies, design tools, design rules, and workflows.
  • Establish and maintain design metrics, and use data-driven decision-making to identify opportunities for process and methodology improvements.
  • Drive design standardization, methodology development, design reuse, and best practices across product families and sites to improve quality, cycle time, and efficiency.
  • Collaborate with RF/SI engineering, measurement, applications engineering, and product engineering teams to optimize electrical and mechanical performance.
  • Balance design resources to meet delivery, quality, cost, and performance objectives.
  • Manage multiple complex development projects through various stages of the product lifecycle.
  • Ensure on-time completion of design milestones, design reviews, and product releases.
  • Provide project status, resource planning, and performance metrics to management.
  • Collaborate with Product Engineering, Mechanical Engineering, Manufacturing Engineering, Operations, Supply Chain, Quality, and Product Management teams.
  • Drive transfer of new products from development into production design.
  • Champion Design for Manufacturability (DFM) and Design for Assembly (DFA) principles.
  • Lead technical investigations and corrective actions for customer-impacting issues.
  • Partner with cross-functional leadership to establish robust SIOP processes.
  • Own and evolve RF probe card design methodologies to improve quality, predictability, scalability, and design cycle time.
  • Drive implementation of design automation, parametric design techniques, CAD tool enhancements, and workflow improvements.
  • Establish and maintain design standards, design rules, templates, libraries, and best practices.
  • Lead initiatives to reduce design iterations, improve first-pass design success rates, and enhance manufacturability.
  • Develop KPIs and performance metrics to measure the effectiveness of design processes and continuous improvement initiatives.
  • Use Lean, Six Sigma, root-cause analysis, and other structured problem-solving methodologies to eliminate recurring design and product quality issues.
  • Lead change management activities related to design methodologies, design rules, CAD tools, and engineering workflows.

Desired Qualifications

  • Experience managing technical professionals and building high-performing teams.
  • Experience in semiconductor wafer probe, RF test systems, or advanced packaging technologies.
  • Experience leading global engineering teams and cross-site development activities.
  • Demonstrated success leading cross-functional development projects from concept through production release.

About the Company

FormFactor

Produces probe cards and test systems

FormFactor provides test and measurement tools for integrated circuits, mainly probe cards and testing systems used across the IC lifecycle. It enables wafer-level testing by connecting devices under test to measurement gear via probe cards, probe stations, analytical probes, and thermal/cryogenic subsystems. The company differentiates itself with a broad, integrated portfolio gained through acquisitions (MicroProbe, Cascade Microtech, FRT, Advantest assets) and a focus on end-to-end wafer testing for DRAM, NAND Flash, SoCs, and high-frequency applications. Its goal is to help semiconductor makers improve device performance and manufacturing yields while speeding time-to-profit by offering reliable, comprehensive test interfaces and measurement systems.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Livermore, CA
Founded
1995

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