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ASM International

Semiconductor deposition equipment and ALD tech

Lead 2 – Engineering Change Planning

Supply Chain ManagementConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A minimum Bachelor's degree in Supply Chain, Engineering, Manufacturing, or a related field.
  • A minimum of 10 years of experience in supply chain planning, with strong exposure to Engineering Change Order/change management.
  • Proven leadership experience managing teams in a complex, global environment.
  • A strong background in the semiconductor or capital equipment industries.
  • Deep knowledge of SAP/MRP systems and Team Center tools.
  • Deep knowledge of Product Lifecycle processes and engineering change workflows.
  • Deep knowledge of supply chain risk management and inventory optimization.
  • Advanced data analytics and visualization skills, such as Power BI.
  • Strong strategic thinking and decision-making capability.
  • Excellent stakeholder management and influencing skills.
  • Exceptional communication and executive presentation skills.
  • A high level of ownership, accountability, and problem-solving ability.

Responsibilities

  • Own and define the global Engineering Change Order planning strategy, including component cut-in, end-of-life, supplier changes, and continuous improvement programs.
  • Establish and enforce Engineering Change Order planning governance, standards, and best practices across regions and organizations.
  • Lead decision-making frameworks for Last Time Buy, risk buys, and inventory exposure optimization.
  • Represent Planning in executive forums, including KPU CRB and senior leadership reviews, providing recommendations and risk visibility.
  • Lead, coach, and develop a team of Engineering Change Order planners to ensure high performance and capability growth.
  • Build organizational bench strength in Engineering Change Order planning, supply risk management, and change control processes.
  • Foster a culture of accountability, collaboration, and continuous improvement.
  • Act as the primary interface between Planning, Engineering, Procurement, Manufacturing, and external partners such as contract manufacturers.
  • Chair and lead cross-functional meetings, including production risk reviews and escalation forums.
  • Drive alignment across stakeholders to ensure timely and effective implementation of engineering changes globally.
  • Oversee the identification and mitigation of material line-down risks and supply disruptions.
  • Ensure robust planning for component transitions, qualification timelines, and replacement part readiness.
  • Monitor and manage the impact of build plan changes on Engineering Change Order timelines, ensuring adherence to target implementation dates.
  • Ensure execution excellence to avoid stockouts, excess inventory, and obsolescence risks.
  • Drive data-driven decision-making through advanced analytics, dashboards, and reporting, such as Power BI.
  • Establish key performance indicators to track Engineering Change Order cycle time, risk exposure, implementation accuracy, and inventory impact.
  • Continuously improve Engineering Change Order processes by leveraging digitization, automation, and system enhancements such as SAP/MRP/PLM.
  • Ensure adherence to Team Center, engineering change workflows, and change control requirements.
  • Drive strong discipline in bill of materials accuracy and timely updates in collaboration with cross-functional teams.
  • Champion compliance with internal policies, industry standards, and audit requirements.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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