C

Cisco

Makes networking gear and security software

Hardware Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeTaipei, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A minimum of an MS degree in Electrical Engineering, Physics, or Material Science, or equivalent educational background.
  • At least 5 years of hands-on experience in chip-on-wafer (CoW) and chip-on-chip (CoC) wafer processing and assembly processes, with quantifiable improvements in quality, yield, and cost.
  • A proven track record of transitioning products from new product introduction (NPI) to high-volume production at outsourced semiconductor assembly and test (OSAT) suppliers.
  • Strong knowledge of various wafer-processing and flip-chip assembly equipment.
  • Experience with design for manufacturability (DFM) during early product development.
  • Strong analytical skills and experience with troubleshooting and JMP scripting, Python, or AI models for automated yield prediction and monitoring.
  • Strong written, verbal, and interpersonal skills, with experience presenting to senior-level leadership.

Responsibilities

  • Take silicon photonics wafer- and chip-level packaging and assembly products from new product introduction (NPI) to high-volume manufacturing (HVM) release with an OSAT partner.
  • Collaborate with Engineering and Technology & Quality teams to set SYL/SBL and other statistical methods to characterize and optimize qualified optical packaging assembly processes, and make decisions on changes to improve yields and product quality.
  • Collaborate with the Technology & Quality team to support new OSAT supplier engagement and introduction of new optical packaging product technology.
  • Drive characterization of NPI product performance and yield, including benchmark correlation, to meet or exceed product cost targets.
  • Collaborate with Engineering and Technology & Quality teams to drive design for X (DFx) for optical packaging design and assembly.
  • Review and monitor ETest/WAT data to proactively drive resolution of critical yield issues.
  • Collaborate with the Design team and Test Engineering to stabilize and improve product screening at wafer-probe and package levels.

Desired Qualifications

  • A PhD degree in Electrical Engineering, Physics, or Material Science.
  • A solid understanding of manufacturing processes related to semiconductor assembly and optical module manufacturing.
  • Experience with copper micro-bump processing, flip-chip assemblies, and through-silicon via (TSV) technologies.
  • Knowledge of post-CMOS backend assembly and packaging process technologies.

About the Company

Cisco

Makes networking gear and security software

Cisco makes the switches and routers that connect offices, data centers, and cloud services, and it also sells cybersecurity tools and Webex video meetings to businesses and governments. It was one of the first companies to sell routers that let different kinds of computer networks exchange data, and in 2000 it briefly became the world's most valuable company. Customers run its network gear, from Wi-Fi access points to AI data center systems, with Cisco software that sets up and secures the network, while its Splunk unit searches computer logs to catch outages and attacks. Cisco earns money from hardware sales, software subscriptions, and support contracts. It was founded in 1984 and is based in San Jose, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Jose, CA
Founded
1984

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