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ASM International

Semiconductor deposition equipment and ALD tech

Senior Principal Engineer - Mechanical Engineering, Advanced Packaging

Design EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Engineering, such as Mechanical, Electrical, Chemical, Systems, or a similar discipline.
  • Experience in semiconductor equipment or complex technical environments.
  • Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.
  • Strong problem-solving ability and system-level thinking.
  • A hands-on approach and the ability to connect theory with real-world system behavior.
  • Analytical skills, including design of experiments (DOE), data analysis, and structured problem solving.
  • Ability to work across global teams and time zones.
  • Strong communication skills, including customer-facing interactions.
  • Willingness to travel internationally approximately 25–50%.

Responsibilities

  • Design and develop semiconductor systems, including equipment selection, process controls, and automation integration.
  • Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.
  • Collaborate with manufacturing, operations, and quality teams to align on goals and deliverables.
  • Provide technical support and troubleshoot equipment and automation systems, driving root cause analysis and resolution.
  • Own bill of materials (BOM) release and maintenance, ensuring accurate documentation and reporting for stakeholders.
  • Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
  • Prepare design documentation for manufacturing and testing prototypes and production products.
  • Act as a system-level technical expert supporting complex semiconductor equipment in development labs and customer fabs.
  • Diagnose and resolve advanced system, hardware, and process issues, including escalations beyond standard support.
  • Drive root cause cause analysis (RCCA) and implement sustainable solutions across tools, sites, and product lines.
  • Support new product introduction (NPI), including early builds, lab validation, and ramp to high-volume manufacturing.
  • Lead or support first-in-fab Alpha and Beta deployments, including installation, start-up, and qualification.
  • Translate field and customer feedback into design, performance, and reliability improvements.
  • Contribute to yield improvement, tool performance, and uptime in demanding fab environments.
  • Develop and share best practices, technical documentation, and global standards.
  • Collaborate cross-functionally with hardware, software, controls, and process engineering teams.
  • Lead or support global initiatives, mentor engineers, and represent ASM in customer-facing teams.

Desired Qualifications

  • Work across a broad range of technologies, including plasma, vacuum, gas delivery, software, and hardware integration.
  • Operate where product development meets real-world fab performance.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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