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Forefront RF

Designs tunable RF front-end technology

Assembly Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeCambridge, UK

About the Job

Requirements

  • A degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or a similar field.
  • Experience in semiconductor assembly, packaging, or manufacturing engineering.
  • Understanding of semiconductor packaging and assembly processes.
  • Familiarity with outsourced semiconductor assembly and test providers and outsourced semiconductor manufacturing.
  • Experience with yield improvement, failure analysis, and process optimisation.
  • A proactive approach to problem-solving and resilience in ambiguous situations.
  • Strong problem-solving and analytical skills.
  • Strong communication and collaboration abilities.
  • Ability to work independently and as part of a team.
  • Attention to detail and commitment to high-quality output.

Responsibilities

  • Manage semiconductor assembly activities across prototype and production builds.
  • Work with outsourced semiconductor assembly and test providers and manufacturing partners on package assembly and process development.
  • Support new product introduction and manufacturing readiness activities.
  • Drive yield improvement and root-cause analysis for assembly-related issues.
  • Coordinate reliability testing, qualification, and failure analysis activities.
  • Collaborate with design, test, and product engineering teams to optimise manufacturability.
  • Create and maintain assembly documentation, process flows, and manufacturing specifications.
  • Identify continuous improvement opportunities across quality, cost, and production efficiency.

Desired Qualifications

  • Experience with radio frequency or mixed-signal semiconductor products.
  • Knowledge of reliability and qualification processes.
  • Familiarity with manufacturing data analysis and process control.
  • Understanding of advanced semiconductor packaging technologies.
  • Experience supporting consumer, Internet of Things, or automotive semiconductor products.

About the Company

Forefront RF

Designs tunable RF front-end technology

Forefront RF develops RF front-end semiconductors for wireless telecom systems. Its patented Tunable Duplexer Technology cancels self-interference between transmitted and received signals, reducing the need for multiple fixed-frequency SAW/BAW filters. This tunable, space-saving solution differentiates Forefront RF from competitors by replacing many crystals with one adaptable device. The goal is to enable more scalable, cost-effective wireless networks for telecom equipment makers, backed by recent investment of £6.7 million.

Company size
11-50
Company stage
Series A
Total funding
$32.2M
Headquarters
Cambridge, United Kingdom
Founded
2020

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