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Microchip introduces its 3,3 kV HV-D3 mSiC(R) power modules for solid-state transformers in AI data centers. May 26th 2026 The new silicon carbide modules offer the thermal performance and efficiency needed for SSTs to supply more power to token generation Microchip Technology today announced the availability of its new HV power modules-D3 mSiC(R) 3,3 kVDesigned to facilitate and accelerate the adoption of solid-state transformers (SSTs) in hyperscale AI data centers and other high-voltage power applications, the new modules integrate mSiC MOSFETs.(R) 3,3 kV silicon carbide (SiC) and Schottky diodes in a standard 62 mm package for efficient and direct power supply from the medium voltage network to the server rack. AI data centers continue to expand rapidly, but token generation is limited by available power supply; at the same time, efficiency is a primary factor for return on investment. Traditional architectures based on bulky, low-frequency transformers add complexity, increase losses, and limit flexibility. solid-state transformers They represent a significant turning point for power supplies, as they reduce the number of conversion stages and allow for increased system efficiency. The adoption of distributed DC power in the rack at higher voltages in next-generation AI centers further increases the value of SSTs, whose purpose was to supply regulated DC directly from the medium-voltage grid with fewer conversion stages. Microchip's HV-D3 mSiC modules are specifically designed to meet these requirements. These modules utilize Microchip's mSiC MOSFET technology, which offers excellent R stability.[DS(on)] Regarding temperature, the encapsulation provides 6 kV insulation, incorporates CTI 600 rated materials, and extends the creepage distances, designed to allow for safe high-voltage series connection. The silicon nitride (Si[3]N[4]) substrate improves thermal connectivity and its ability to withstand power cycling, thus helping engineers increase power density with less aggressive cooling. "AI data centers continue to increase the demands on power delivery between the electrical grid and the GPU, making solid-state transformers increasingly important," said Clayton Pillion, vice president of Microchip's High Power Solutions business unit. "Our 3,3 kV HV-D3 mSiC power modules allow designers to reduce the number of devices connected in series by about half compared to other lower-voltage SiC devices when connected to 13,8 kV or 34,5 kV networks. These devices also fill a critical gap in the industrial market for 100-300 A products by integrating discrete SiC devices and much larger power modules." The HV-D3 mSiC power modules are available in half-bridge and common-source configurations, with and without antiparallel Schottky diodes, for applications in the 100-300A range. Microchip's mSiC MOSFET technology offers balanced switching losses for both hard and soft switching topologies, making these devices well-suited for SST designs and other high-frequency, high-voltage systems. While optimized for solid-state transformers in AI data centers, HV-D3 mSiC power modules also address a wide range of applications, including megawatt charging infrastructure for heavy vehicles, auxiliary power supplies for rail and heavy transport, medium-voltage motor drives, and industrial and defense power systems. These markets benefit from the same combination of high insulation, thermal robustness, and efficient power conversion. Microchip has over 20 years of experience developing, designing, manufacturing, and supporting SiC power devices and solutions to help customers adopt SiC easily, quickly, and confidently. The company's mSiC products and solutions are designed to reduce system costs, shorten time to market, and minimize risk. Microchip offers a broad and flexible range of SiC diodes, MOSFETs, and gate drivers. For more information, visit [website address]. www.microchip.com/sic. Development tools The 3,3 kV power modules are supported by a application notes, a design guide, and device and simulation models for rapid prototype development. Microchip also provides global technical support, design services, and on-site application engineering support. Prices and availability 3,3 kV mSiC power modules are now available acquire in production quantities, either directly to Microchip or through a sales representative or authorized distributor from Microchip. High-resolution images are available on Flickr or by editorial contact (free publication):

NASA's new AI space chip could let spacecraft think for themselves. May 25, 2026 0 comments NASA is developing a powerful new computer chip designed to dramatically increase the intelligence and performance of future spacecraft. Through a commercial partnership, the project is creating advanced processing technology capable of helping spacecraft operate more independently during missions far from Earth. NASA's High Performance Spaceflight Computing project is focused on boosting the computing capabilities of spacecraft used in space exploration. Current missions rely on older processors because they are durable enough to survive the extreme conditions of space. While those chips are dependable, they lack the performance needed for more advanced missions. The agency says newer and far more capable processors are essential for future autonomous spacecraft, faster onboard scientific analysis, and supporting astronauts during missions to the Moon and Mars. "Building on the legacy of previous space processors, this new multicore system is fault-tolerant, flexible, and extremely high-performing," said Eugene Schwanbeck, program element manager in NASA's Game Changing Development program at the agency's Langley Research Center, in Hampton, Virginia. "NASA's commitment to advancing spaceflight computing is a triumph of technical achievement and collaboration." Radiation Hardened Processor Faces Extreme Testing At the center of the project is a new radiation-hardened processor built to deliver up to 100 times the computing power of today's spaceflight computers while surviving the harsh environment of space. Engineers at NASA's Jet Propulsion Laboratory (JPL) in Southern California are running a wide range of tests designed to simulate those conditions. "We are putting these new chips through the wringer by carrying out radiation, thermal, and shock tests while also evaluating their performance through a rigorous functional test campaign," said Jim Butler, High Performance Space Computing project manager at JPL. To qualify for spaceflight, the processor must withstand intense electromagnetic radiation and dramatic temperature fluctuations that can damage electronics. High-energy particles from the Sun and deep space can also trigger computer errors that force spacecraft into "safe mode," temporarily shutting down nonessential systems until engineers resolve the issue. NASA is also testing how the chip handles the challenges of planetary landings. "To simulate real-world performance, we are using high-fidelity landing scenarios from real NASA missions that would typically require power-intensive hardware to process huge volumes of landing-sensor data," said Butler. "This is an exciting time for us to be working on hardware that will enable NASA's next giant leaps." Testing at JPL began in February and is expected to continue for several months. Early results have been highly encouraging. According to NASA, the processor is functioning as intended and has shown performance levels roughly 500 times greater than the radiation-hardened chips currently used in spacecraft. The team also marked the beginning of testing with a symbolic moment by sending an email titled "Hello Universe," referencing the famous introductory messages used during the early days of computer programming. AI Powered Spacecraft and Deep Space Missions The processor is being developed jointly by JPL and Microchip Technology Inc., based in Chandler, Arizona. The company is working with NASA through a commercial partnership, and sample chips have already been shared with defense and commercial aerospace partners. The technology is expected to play a major role in the future of autonomous spacecraft. With onboard artificial intelligence, spacecraft could respond to unexpected situations in real time when communication delays make human control impractical. The chip could also help deep space missions process, store, and transmit massive amounts of scientific data back to Earth more efficiently. NASA says the processor may eventually support crewed missions to the Moon and Mars as well. Small Processor With Massive Computing Power The device is known as a system-on-a-chip (or SoC), meaning it combines the essential components of a computer into a single compact unit. The processor includes central processing units, computational offloads, advanced networking systems, memory, and input/output interfaces. SoCs are widely used in smartphones and tablets because they are compact and energy efficient. However, NASA's version is designed to survive for years in deep space, potentially traveling millions (or even billions) of miles from Earth without maintenance or repairs. Once the processor is certified for use in space, NASA plans to integrate it into a wide variety of missions, including Earth orbiters, planetary rovers, deep space probes, and crewed habitats. The technology could also have benefits on Earth. Microchip plans to adapt the processor for industries such as aviation and automotive manufacturing. NASA and Industry Collaboration The project is managed by the Space Technology Mission Directorate's Game Changing Development (GCD) program at NASA Langley. The GCD program and JPL, which is managed by Caltech in Pasadena, California, oversaw the development process from mission planning and industry studies through final delivery. NASA JPL selected Microchip as a partner in 2022, and the company funded its own research and development work on the processor.