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Absolics

Makes glass substrates for semiconductor packages

Plating Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeCovington, GA, USAIn-person

About the Job

Requirements

  • Understand chemical concentration analysis devices and methods.
  • Be proficient in Microsoft Excel and statistical analysis tools such as JMP or Minitab.
  • Have strong organizational, interpersonal, and communication skills.
  • Be able to work in a semiconductor cleanroom environment and safely handle or be exposed to chemicals commonly used in semiconductor manufacturing processes.
  • Be able to work independently with minimal supervision while meeting commitments and deadlines.
  • Be able to quickly learn and adapt to new technologies and processes.
  • Be highly motivated, self-driven, and detail-oriented, with a strong work ethic.
  • Hold a bachelor's degree in Mechanical Engineering, Chemical Engineering, or a related field.

Responsibilities

  • Manage the process based on an understanding of the plating process.
  • Operate plating processes and equipment, and analyze optimization conditions.
  • Maintain processes in accordance with customer specifications and internal operational standards.
  • Develop and standardize process recipes through structured engineering practices.
  • Perform statistical process control and monitoring using appropriate statistical tools.
  • Analyze defects and implement continuous process improvement.
  • Perform engineering and process-related tasks in a semiconductor cleanroom environment while following strict contamination control procedures and safety protocols.

Desired Qualifications

  • One year of experience in Semiconductor, PWB, or OSAT is preferred but not required.

About the Company

Absolics

Makes glass substrates for semiconductor packages

Absolics develops glass substrates and advanced packaging technology for semiconductor businesses building high-performance computing and AI systems. A substrate forms the base that connects processing and memory chips within a single package, linking the separate parts of a complex computing system. Its glass-core approach is designed to support smaller, more densely packed connections and shorter electrical paths. The company is developing glass panels for supply to advanced semiconductor packaging customers, with related technologies for embedding components and managing heat. Established in 2021, Absolics is headquartered in Covington, Georgia.

Company size
51-200
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$452.3M
Headquarters
Covington, GA
Founded
2021

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