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Skorpios Technologies

Develops wafer-scale silicon photonics modules

Vice President Fab Engineering

Full-Time
$190k - $260k
Expert
Master's, PhD
Temecula, CA, USA
In Person
Engineering ManagementEngineering Leadership
No H1B Sponsorship

About the job

Requirements
  • A master's degree or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a highly related engineering or scientific discipline.
  • At least 15 years of progressive technical experience in semiconductor manufacturing, with a deep understanding of Front End (FEOL) and Back End (BEOL) processing.
  • At least 7 years in a senior director or executive-level role directly managing multidisciplinary engineering organizations within a 24/7 manufacturing environment.
  • Demonstrated success scaling a semiconductor fabrication facility from low-volume research and development or prototyping into stable, profitable high-volume manufacturing.
  • Proven mastery of managing high-volume semiconductor manufacturing facilities, including deep understanding of silicon photonics, MEMS, or advanced CMOS nodes.
  • Advanced capability in managing large-scale budgets, calculating return on investment for capital equipment, and executing cost of goods sold reduction strategies.
  • Mastery in building alignment and navigating competing priorities across Operations, R&D, Finance, Supply Chain, and Commercial teams.
  • Proven ability to lead large technical organizations through rapid scaling, structural transformations, and technological pivots.
  • Must be a U.S. person under ITAR: a U.S. citizen, U.S. permanent resident, political asylee, or refugee.
  • Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.
  • Ability to travel up to 25% for vendor evaluations, customer executive reviews, and industry conferences.
  • Ability to periodically inspect and walk through the Fab cleanroom while wearing full cleanroom personal protective equipment.
Responsibilities
  • Define and execute the long-term technical roadmap for Fab operations, aligning engineering capabilities with corporate growth, product roadmaps, and business unit priorities.
  • Hold ultimate accountability for Fab operational performance metrics, including baseline wafer yield, factory cycle time, overall equipment effectiveness, and cost per wafer.
  • Unify and direct Process, Integration, Equipment, and Yield engineering organizations to eliminate silos, accelerate new product introductions, and ensure seamless technology transfers.
  • Lead the Fab capital expenditure strategy, overseeing tool procurement, facility expansions, cleanroom space optimization, and capacity planning.
  • Lead executive-level negotiations and maintain strategic partnerships with semiconductor equipment manufacturers, chemical and material suppliers, and external foundries.
  • Establish and enforce quality management systems, and lead the Fab response to critical technical excursions or supply chain risks to ensure business continuity.
  • Develop and manage the annual operating budget for Fab engineering, identifying structural cost-reduction opportunities without sacrificing yield or quality.
  • Build, mentor, and scale an engineering leadership team; drive workforce development, succession planning, and a culture centered on safety, data-driven accountability, and continuous improvement.
  • Provide executive direction to a senior leadership team, including Directors of Process Engineering, Process Integration, and Equipment Engineering.
  • Oversee organizational design, headcount planning, and talent allocation for the Fab engineering organization.
  • Establish organizational goals and performance-tracking frameworks, and provide executive coaching for department heads.
  • Synthesize complex technical data into concise strategic insights for the Board, CEO, customers, and investors.
Desired Qualifications
  • A PhD in a relevant engineering field with published contributions to semiconductor or photonics technology.
  • Extensive experience with silicon photonics integration or advanced optical communication device manufacturing.
  • Formal certifications in Lean Manufacturing, Six Sigma Executive Leadership, or advanced Project Management (PMP).

About the company

Skorpios Technologies designs and sells integrated photonics products built on a proprietary wafer-scale silicon photonics process. Its offerings include modules and components for ethernet pluggable optics, copackaged optics, Lidar, and biosensors, serving telecommunications, data centers, automotive, and healthcare markets. The technology combines lasers, modulators, and photodiodes on a single wafer to create compact, efficient devices used for data transmission and optical sensing. This approach differentiates Skorpios from competitors by using its unique wafer-scale silicon photonics architecture and in-house foundry services to deliver high-performance, densely integrated optical solutions. The company’s goal is to provide fast, reliable optical transmission and sensing technologies that meet the growing demand across multiple industries by delivering advanced photonics products and fabrication services.

Company Size

51-200

Company Stage

Series D

Total Funding

$67.9M

Headquarters

Temecula, California

Founded

2009

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Simplify's Take

What believers are saying

  • Skorpios announced 1.6 Tbps and 6.4 Tbps optical engines on May 7, 2026.
  • The May 7, 2026 0.35 FIT milestone shifts failure risk from lasers to packaging.
  • Temecula funding in 2025 financed relocation and restart, restoring manufacturing capacity.

What critics are saying

  • Broadcom's Bailly and NVIDIA's Spectrum-X CPO shipped in 2026, squeezing pluggable demand.
  • Skorpios' Temecula restart followed 2023 Austin shutdown and 60 layoffs, signaling fragile operations.
  • If hyperscalers standardize on Broadcom optical engines, Skorpios becomes a niche supplier.

What makes Skorpios Technologies unique

  • Skorpios' Tru-SiPh integrated lasers hit 0.35 FIT on May 7, 2026.
  • It integrates lasers, modulators, and photodiodes on-wafer, removing discrete alignment complexity.
  • Its 1.6 Tbps and 6.4 Tbps optical engines target 102.4T AI switches.

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Benefits

  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Disability Insurance
  • Paid Holidays
  • Paid Vacation
  • Gym Membership

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-2%

2 year growth

-4%
Associated Press
Mar 17th, 2026
Skorpios achieves 0.35 FIT laser reliability, shifting silicon photonics bottleneck to packaging

Skorpios Technologies has achieved a 0.35 FIT (Failures In Time) reliability rate for integrated lasers in its Tru-SiPh platform, according to a new white paper released at OFC 2026. The milestone shifts the primary reliability bottleneck from lasers to physical packaging in optical systems. The company's wafer-scale integration eliminates mechanical vulnerabilities found in traditional optical transceivers, which typically exhibit failure rates between 120 and 300 FIT. Skorpios integrates two lasers and one Semiconductor Optical Amplifier per channel directly into silicon, removing the need for discrete laser alignment and external fibre channels. The Temecula, California-based company's approach addresses thermal and mechanical constraints in co-packaged optics and high-speed Ethernet switching architectures. Skorpios provides silicon photonics solutions for AI infrastructure, hyperscale networking and other advanced applications.

Military Industry Today
Sep 11th, 2023
Skorpios Technologies Announces Reopening of Services in New Fab Facility in Temecula California

Skorpios Technologies announces reopening of services in new Fab facility in Temecula california.

Skorpios Technologies, Inc.
Mar 2nd, 2023
Skorpios Technologies, Inc. Today Announces the Relocation of Its Semiconductor Wafer Fabrication Operation to Southern California | Skorpios Technologies Inc.

Skorpios Technologies, Inc., a vertically integrated leader in heterogeneously integrated silicon photonics announced today that it will be moving fab operations from Austin, Texas to Southern California.

The Business Journals
Feb 14th, 2023
Skorpios to close Austin factory, cut 60 jobs

Semiconductor company Skorpios Technologies Inc. plans to cut 60 employees and shut down an Austin factory after it couldn't negotiate a new lease with its landlord, the University of Texas.