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Skorpios Technologies

Develops wafer-scale silicon photonics modules

Vice President of Fab Engineering

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeTemecula, CA, USA$190k - $260k /yr

About the Job

Requirements

  • A master's degree or PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a highly related engineering or scientific discipline.
  • At least 15 years of progressive technical experience in semiconductor manufacturing, including deep understanding of Front End (FEOL) and Back End (BEOL) processing.
  • At least 7 years in a senior director or executive-level role directly managing multidisciplinary engineering organizations within a 24/7 manufacturing environment.
  • Demonstrated success scaling a semiconductor fabrication facility from low-volume research and development or prototyping into stable, profitable high-volume manufacturing.
  • Proven mastery of managing high-volume semiconductor manufacturing facilities, including deep understanding of silicon photonics, MEMS, or advanced CMOS nodes.
  • Advanced capability in managing large-scale budgets, calculating return on investment for capital equipment, and executing cost of goods sold reduction strategies.
  • Mastery in building alignment and navigating competing priorities across Operations, Research and Development, Finance, Supply Chain, and Commercial teams.
  • Proven ability to lead large technical organizations through rapid scaling, structural transformations, and technological pivots.
  • Must be a U.S. person under ITAR: U.S. citizen, U.S. permanent resident, political asylee, or refugee.
  • Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.

Responsibilities

  • Define and execute the long-term technical roadmap for Fab operations, aligning engineering capabilities with corporate growth, product roadmaps, and business unit priorities.
  • Hold ultimate accountability for Fab operational performance metrics, including baseline wafer yield, factory cycle time, overall equipment effectiveness, and cost per wafer.
  • Unify and direct all Fab engineering organizations—Process, Integration, Equipment, and Yield—to eliminate silos, accelerate new product introductions, and ensure seamless technology transfers.
  • Lead the Fab's capital expenditure strategy, overseeing tool procurement, facility expansions, cleanroom space optimization, and advanced capacity planning.
  • Lead executive-level negotiations and maintain strategic partnerships with semiconductor equipment manufacturers, chemical and material suppliers, and external foundries.
  • Establish and enforce quality management systems, leading the Fab response to critical technical excursions or supply chain risks to guarantee 24/7 business continuity.
  • Develop and manage the annual operational budget for Fab engineering, identifying structural cost-reduction opportunities without sacrificing yield or quality.
  • Build, mentor, and scale an engineering leadership team; drive workforce development programs, succession planning, and a culture centered on safety, data-driven accountability, and continuous improvement.
  • Provide executive direction to senior leaders, including Directors of Process Engineering, Process Integration, and Equipment Engineering.
  • Oversee organizational design, headcount planning, and talent allocation for the entire Fab engineering organization.
  • Establish organizational goals and performance-tracking frameworks and provide executive coaching for department heads.
  • Synthesize complex technical data into strategic insights for the Board, CEO, customers, and investors.
  • Navigate competing priorities across Operations, Research and Development, Finance, Supply Chain, and Commercial teams.

Desired Qualifications

  • A PhD in a relevant engineering field with published contributions to semiconductor or photonics technology.
  • Extensive experience with silicon photonics integration or advanced optical communication device manufacturing.
  • Formal certification in Lean Manufacturing, Six Sigma Executive Leadership, or advanced Project Management (PMP).

About the Company

Skorpios Technologies

Develops wafer-scale silicon photonics modules

Skorpios Technologies designs and sells integrated photonics products built on a proprietary wafer-scale silicon photonics process. Its offerings include modules and components for ethernet pluggable optics, copackaged optics, Lidar, and biosensors, serving telecommunications, data centers, automotive, and healthcare markets. The technology combines lasers, modulators, and photodiodes on a single wafer to create compact, efficient devices used for data transmission and optical sensing. This approach differentiates Skorpios from competitors by using its unique wafer-scale silicon photonics architecture and in-house foundry services to deliver high-performance, densely integrated optical solutions. The company’s goal is to provide fast, reliable optical transmission and sensing technologies that meet the growing demand across multiple industries by delivering advanced photonics products and fabrication services.

Company size
51-200
Company stage
Series D
Total funding
$67.9M
Headquarters
Temecula, CA
Founded
2009

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