Soitec

Engineered substrates for silicon-on-insulator wafers

RITE Process Technician

Machine & Process OperationUpdated on Nov 10

Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

A minimum Nitec qualification in any engineering field is required; a field related to semiconductor manufacturing or materials engineering is preferred.
Experience in semiconductor wafer fabrication or manufacturing in a cleanroom environment is required.
Knowledge of Diffusion, CVD, Plasma, Implant, and/or RTP processes is advantageous.
Willingness to work a 12-hour shift pattern and adapt to operational requirements is required.
Proficiency in Microsoft Office applications, including Word, Excel, and PowerPoint, is required.
Familiarity with SiView or JMP software is an added advantage.

Responsibilities

Re-qualify tools according to post-preventive-maintenance and corrective-maintenance qualification plans.
Execute Out of Control Action Plans and process-based corrective or preventive actions in response to Out of Control, Out of Specifications, or process abnormality events.
Provide timely updates to passdown logs with accurate information and details for every incident or instruction from the Process Engineer or Equipment Engineer.
Prepare and present daily reports on production line health and performance metrics, including Statistical Process Control and hold lot reviews.
Take ownership of simple processes or measurement tools when necessary.
Lead and/or participate in process and/or operational improvement projects.

Desired Qualifications

Knowledge of Diffusion, CVD, Plasma, Implant, and/or RTP processes.
Familiarity with SiView or JMP software.

Introduce Soitec and context of the position

How does something you do not see improve your daily life? This is what our products do and they are in your smartphones, cars, and connected objects. They make them more efficient and less energy intensive. We are passionate about innovation in technology and proud of the value we create for our customers. At Soitec, we are also in a state of transformation: cultural, managerial and digital. We want to make our company an organization where freedom of action and accountability guide our actions. Do you want to change things or test a new idea? If so, what are you waiting for? It is time to come to Soitec!

What does the job consist?

Re-qualify tools according to post Preventive Maintenance (PM) and Corrective Maintenance (CM) qualification plans
Execute Out of Control Action Plans (OCAPs) and process-based corrective/preventive actions in response to Out of Control (OOC), Out of Specifications (OOS) or process abnormality events
Provide timely updates to passdown logs with accurate information and details for every incident or instruction given by the Process Engineer (PE) or Equipment Engineer (EE)
Prepare and present daily reports on production line health and performance metrics (e.g. SPC, hold lot reviews)
Take ownership of simple processes or measurement tools where necessary
Lead and/or participate in process and/or operational improvement projects

Requirements & qualifications

Min. Nitec in any engineering field, preferably related to semiconductor manufacturing or materials engineering
Experience in semiconductor wafer fabrication/manufacturing in a cleanroom environment
Knowledge of Diffusion, CVD, Plasma, Implant and/or RTP processes is advantageous
Must be willing to work a 12-hour shift pattern and adapt to operational requirements
Team player with a positive attitude and willingness to learn
Proficient in Microsoft Office applications (Word, Excel, PowerPoint)
Familiarity with SiView/JMP software is an added advantage

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Bernin, France
Founded: 1992

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