GlobalFoundries

GlobalFoundries

Semiconductor foundry delivering specialized chips

Emulation Engineer New Grad

Full-TimeUpdated on 9/29/2026
$86k - $148k/yr
Entry
Bachelor's, Master's
Richardson, TX, USA
In Person
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • Graduating with a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field from an accredited degree program.
  • Must have an overall GPA of at least 3.0 and be in good academic standing.
  • Fluency in written and verbal English.
  • Academic, internship, project, or practical experience with hardware emulation, digital design verification, FPGA prototyping, or related CPU/SoC development workflows.
  • Experience with or exposure to hardware emulation platforms such as Veloce, ZeBu, Palladium, or similar systems.
  • Strong scripting skills using Python, Tcl, Bash, Make, or related automation languages and build tools.
  • Strong debugging and structured problem-solving skills across CPU-internal issues, integration failures, emulator configuration or synthesis issues, scripting errors, and Linux software or environment problems.
Responsibilities
  • Build and configure designs for hardware emulation, execute directed and regression tests, identify points of failure, capture waveforms and logs, and perform initial failure triage.
  • Develop, improve, and maintain emulation testbench components, including custom IP, acceleration verification IP, transactors, monitors, and supporting infrastructure where applicable.
  • Partner with design, architecture, verification, software, and emulation teams to reproduce issues, isolate root causes, and support efficient debugging of CPU, IP, integration, synthesis, and platform failures.
  • Develop and maintain scalable scripts, build flows, and automation that can be reused across product lines to improve emulation setup, execution, reporting, and turnaround time.
  • Apply knowledge of emulation architecture and platform capabilities to optimize debugging strategies and improve build quality, including performance, compile time, capacity, and resource utilization.
  • Document emulation environments, test results, failure signatures, debug findings, and recommended next steps to support technical reviews and repeatable engineering workflows.
  • Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs.
Desired Qualifications
  • Prior related internship or co-op experience.
  • Prior leadership experience in the workplace, school projects, competitions, or similar settings.
  • Interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support decision-making.
  • Project management skills, including the ability to innovate, execute meaningful solutions, and navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.
  • Understanding of SoC and IP integration, including interconnects, bridges, tie-offs, memory-mapped registers, clocks, resets, and related system-level interfaces.
  • Experience with RISC-V assembly and computer architecture concepts.
  • Knowledge of AMBA interconnect protocols such as AHB, APB, or AXI.
  • Experience with the Linux kernel, Linux-based development environments, and revision-control systems such as Perforce or Git.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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6 month growth

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Yahoo Finance
Sep 19th, 2026
Marvell and GlobalFoundries expand silicon germanium deal to meet surging data centre demand

Marvell Technology and GlobalFoundries expanded their partnership to boost production of silicon germanium (SiGe), a semiconductor technology used in high-speed optical connections for data centres. Following the announcement on 17 September, Marvell shares rose over 4% whilst GlobalFoundries climbed more than 6%. The multi-year agreement will increase SiGe manufacturing capacity at GlobalFoundries' Burlington, Vermont facility. The technology enables semiconductor devices to operate at higher speeds with reduced energy consumption. GlobalFoundries reported strong demand for SiGe, with CEO Tim Breen noting the company is "oversubscribed throughout 2027". The firm's communications infrastructure and data centre segment revenue jumped 62% year over year in Q2 2026. Marvell posted record revenue of $2.739 billion in Q2 fiscal 2027, up 37% year over year, driven by AI data centre demand.

Omega Technology Solutions Group, Inc.
Sep 9th, 2026
Kepler Computing raises $468M to boost memory density without EUV lithography

Kepler Computing has raised $468 million from investors including GlobalFoundries, Intel Capital, AMD Ventures, and Bill Gates to develop memory chips that bypass expensive extreme ultraviolet lithography. The San Jose startup uses ferroelectric materials and 3D stacking to increase high-bandwidth memory and SRAM density whilst working with existing semiconductor fabs. The company claims it can convert a fab to next-generation capability in eight months versus the typical 24-month timeline. However, the technology faces contamination challenges because its composite material includes iron, requiring dedicated equipment or encapsulation. Kepler has been testing at GlobalFoundries facilities in Singapore and Vermont, producing chips on approximately 2,000 wafers. The US Department of Commerce committed up to $245 million in July to support domestic development. First HBM samples are planned for late 2025, with US production targeted for 2028.

Crypto Briefing
Sep 9th, 2026
Kepler Computing claims new chip design can solve AI memory shortage

Kepler Computing lands $245 million in CHIPS Act funding for ferroelectric RAM technology it claims can solve the AI-driven memory shortage with

Associated Press
Sep 2nd, 2026
GlobalFoundries and RAAAM tape out GCRAM chip, achieving 40% area shrink and 60% power reduction vs SRAM

GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.

PR Newswire
Sep 2nd, 2026
QuickLogic launches enhanced eFPGA Hard IP for GlobalFoundries 12LP with 250K+ LUT scalability

QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.