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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

High-Speed 1/F Subsystem Design Leader

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeKodaira, Tokyo, JapanNo salary listed

About the Job

Requirements

  • Practical experience in specification review, design, verification, or performance evaluation in at least one of PCIe, UCIe, USB, or UFS.
  • Experience organizing design approaches and technical issues based on requirements and sharing them with stakeholders.
  • Understanding of the logical design and verification process, and experience actively participating in design reviews and technical discussions.
  • Ability to collaborate with teams and related IP owners and contribute to technical consensus.
  • Willingness to participate in technical meetings and specification reviews in English.

Responsibilities

  • Develop specifications and consider architectures for high-speed interface subsystems in automotive SoCs in the R-Car series.
  • Organize and evaluate design approaches for high-speed interface subsystems including PCIe, UCIe, USB, and UFS, balancing the assigned area with optimization of the full subsystem.
  • Help advance development by organizing technical issues and participating in design decisions during logical design and verification.
  • Make technical assessments and decisions that account for power, performance, reliability, and consistency with the overall SoC.
  • Communicate technically with IP vendors and participate in confirming specifications and organizing constraints for adopted IP.
  • Drive global development in coordination with design centers in India and Vietnam and IP vendors in English.

Desired Qualifications

  • Experience coordinating or leading technical work at the subsystem or IP level.
  • SoC integration experience involving PCIe, UCIe, USB, or UFS.
  • Knowledge of power-domain isolation design and physical design (place and route).
  • Automotive SoC development experience, or experience with design and verification that accounts for functional safety and reliability.
  • Experience coordinating and negotiating technical matters with IP vendors or overseas sites.
  • Japanese communication-level proficiency.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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