Advanced Engineer
Kulicke & Soffa
Advanced Engineer
Kulicke & Soffa
Manufactures semiconductor packaging equipment and tools
The candidate will be a member of a multi-site K&S team that develops and sustains semiconductor assembly equipment.
The successful incumbent will be responsible for the design, development, documentation and testing of mechanical subsystems that is part of a high-performance semiconductor assembly machine under development.
Degree in Mechanical engineering (BS minimum, MS preferred)
4-8 years of hand-on engineering development experience with electromechanical systems
CAD program experience with Siemens NX and Teamcenter PLM software
Programming experience with electromechanical systems
Experience with mechanical measurements such as motion accuracy, force, temperature, vibration, and pneumatics.
Finite element analysis software experience is a plus
Ability to use sophisticated software tools for analysis is a plus (e.g. MATLAB, C++, etc)
Attention to detail and good understanding of physical principles governing machine behavior
Effective verbal & written communication skills, a positive attitude, an open mindset and a team-oriented individual
Must be self-driven, resourceful and organized
Able to work in an environment with heavy multi-site engineering and cross functional collaboration
Must be able to travel internationally (up to 30%)
Support the development, production and use of existing and next generation semiconductor assembly equipment products within the Advanced Solutions Business Unit.
Design mechanical components, modules and systems according to system specifications
Assessment of mechanical designs and reliability using hand calculations, FEA, statistics, etc
Support fabrication and build of production systems
Development of design documentation including the detailing of drawings
Create product validation plans including required testing through experimental setups
Define mechanical sub-system requirements and specifications
Provide expert technical support to our field engineers and customers including visits to our Asian locations and customer fabrication plants.
Manufactures semiconductor packaging equipment and tools
Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.
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