H

Hewlett Packard Enterprise

Builds servers, networking and private cloud

NPI Manufacturing Engineer - PCBA

Full-TimeUpdated on 10/14/2026
No salary listed
Mid, Senior
Bachelor's, Master's
Aguadilla, Puerto Rico
HybridHybrid role requiring an average of two days per week in an HPE office. Domestic and international travel may be required, typically up to 10%.
Manufacturing & Process EngineeringManufacturing Engineering

About the job

Requirements
  • A bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline is required.
  • Four to six years of experience in electronics manufacturing, including significant experience supporting NPI programs for complex PCBAs and electronic systems.
  • Experience working with OEM product development teams and/or Electronics Manufacturing Services (EMS) partners.
  • Demonstrated experience supporting new product introduction from prototype through production ramp.
  • Strong understanding of PCBA manufacturing processes and technologies.
  • Advanced English level.
  • Strong knowledge of PCBA manufacturing processes, including SMT assembly, BGA assembly and rework, wave soldering, press-fit technologies, rework and repair processes, and component qualification and introduction.
  • Understanding of PCB fabrication technologies, materials, and stack-up design.
  • Knowledge of IPC standards, particularly IPC-A-610.
  • Experience with DFM, DFT, PFMEA, DOE, and manufacturing process validation techniques.
  • Strong statistical analysis, root cause analysis, and problem-solving skills.
  • Ability to evaluate manufacturing yield, quality, reliability, and cost performance metrics.
  • Proficiency with engineering tools and software for product evaluation, manufacturing analysis, and process improvement.
Responsibilities
  • Serve as the primary manufacturing engineering representative on NPI teams for complex PCBA-based products from concept through production ramp and sustaining.
  • Lead Design for Manufacturing (DFM) reviews to ensure PCBAs and PCB designs meet manufacturing, quality, reliability, and cost objectives.
  • Collaborate with R&D, Signal Integrity, PCB suppliers, Test Engineering, Quality, and Operations teams to optimize product designs for manufacturability and testability.
  • Support the development of PCB stack-ups and manufacturing requirements in coordination with design and supplier teams.
  • Coordinate and lead activities with internal teams and outsourced manufacturing partners to ensure successful product launches and production readiness.
  • Evaluate prototype builds and early production runs, identifying manufacturing risks and implementing corrective actions.
  • Analyze manufacturing, quality, test, reliability, and customer feedback data to identify opportunities for product and process improvements.
  • Perform engineering analysis and root cause investigations for defective products, assemblies, and manufacturing process failures.
  • Drive resolution of PCBA and PCB manufacturing issues related to SMT, BGA assembly and rework, wave soldering, press-fit technologies, component qualification, and new package introductions.
  • Develop, monitor, and support Design of Experiments (DOE) activities to optimize manufacturing processes and validate critical process parameters.
  • Improve yield, cycle time, product quality, and manufacturing scalability while reducing cost and lead time.
  • Communicate manufacturing risks, findings, and recommendations to project stakeholders and management teams.
  • Represent the manufacturing engineering organization during design reviews, factory readiness reviews, supplier engagements, and product qualification activities.
Desired Qualifications
  • A master's degree.
  • Experience with server, networking, storage, telecommunications, or other complex electronics products.
  • Knowledge of PCB CAD design practices, PCB fabrication technologies, and stack-up development.
  • Experience working with global manufacturing and supplier organizations.
  • Familiarity with high-volume manufacturing and process qualification methodologies.
  • Lean manufacturing, Six Sigma, or continuous improvement training/certification.

About the company

H

Hewlett Packard Enterprise

View

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company Size

10,001+

Company Stage

IPO

Headquarters

Houston, Texas

Founded

1939

Get referred to Hewlett Packard Enterprise

See people who can refer or advise you

Simplify Jobs

Simplify's Take

What believers are saying

  • Growth is strong: revenue hit a record $12.2 billion, up 34%, in the quarter reported September 2026.
  • Time off to recharge: HPE gives four Wellness Fridays off a year plus 60 hours of paid volunteer time.
  • Scale gives range: HPE runs server, storage, networking and supercomputer businesses under one employer.

What critics are saying

  • Cuts continue after Juniper: an October 2025 WARN notice listed 52 HPE layoffs in San Jose, California.
  • Integration pressure: HPE still targets $600 million in yearly Juniper cost savings by fiscal 2028, as of October 2026.
  • Supply limits sales: in September 2026, CEO Antonio Neri said memory supply stays very constrained until 2028.

What makes Hewlett Packard Enterprise unique

  • Networking is now core: Juniper helped make networking a $2.9 billion business in the quarter reported September 2026.
  • AI networking is surging: Networks for AI orders hit a record $700 million in the quarter reported September 2026.
  • Hybrid cloud model: GreenLake bills customers monthly for on-premises servers and storage they use.

Help us improve and share your feedback! Did you find this helpful?

Benefits

  • Health Insurance
  • Flexible Work Hours
  • Hybrid Work Options
  • Professional Development Budget
  • Wellness Program

Growth & Insights and Company News

Headcount

6 month growth

11%

1 year growth

11%

2 year growth

11%
The Register
Oct 20th, 2026
HPE to run AI on the Moon this year with Spaceborne Computer 4 aboard Astrolab's FLIP rover

Hewlett Packard Enterprise (HPE) will run AI on the Moon before the end of the year. Its fourth-generation Spaceborne Computer (SBC4) will fly aboard Astrolab's Flex Lunar Innovation Platform (FLIP) rover, part of NASA's Commercial Lunar Payload Services programme. A SpaceX Falcon Heavy rocket will launch the rover, and Astrobotic's Griffin-1 lander will carry it to the Moon's south pole near Mons Mouton. SBC4 will run tuned large language model tests, machine learning on camera and LiDAR data, and supercomputing benchmarks, which could make it the first Top500 submission from a celestial body. The 1TB system uses mostly off-the-shelf parts, including Kioxia SSDs in a software RAID 1 mirror. Processing data locally saves scarce bandwidth back to Earth.

Yahoo Finance
Oct 14th, 2026
HPE shares fall 7.4% as Barclays downgrades and cuts target to $77

Hewlett Packard Enterprise (HPE) shares fell about 7.4% to $63.695 at 11:48 ET on October 14, after Barclays downgraded the stock to Equal Weight. The bank cut its price target to $77 from $83 but left its financial forecasts unchanged. The move questions how much investors should pay for HPE's growth story, not its earnings outlook. The share price sits 124.2% above GuruFocus's GF Value estimate of $28.41. Data-center networking revenue rose 112.2% year over year to $382 million, about 3.1% of quarterly revenue of $12.2 billion. The wider Networking segment brought in $2.9 billion at a 22% operating margin, against 17% for Cloud & AI. The next earnings report must show stronger evidence that the premium is justified.

LinkedIn
Oct 14th, 2026
#softwaredefined | TidalScale | 31 comments

TidalScale began with a vision to establish a new category of computing offering unprecedented scalability, flexibility, and ease of deployment for large memory systems.  This was accomplished by stitching together industry standard computers connected with Ethernet to create a virtual server of essentially any size.  We called this innovation Software-Defined Servers.  Along the way there were many additional innovations including the recently announced TidalGuard™ technology which allowed for the hot-swapping of computers, enabling nodes to be replaced at the first sign of impending failure – all while keeping the application up and performant.  This was just one of the 30 issued patents on our technology. A new chapter is unfolding for Software-Defined Servers as TidalScale’s technology and many key team members will now be a part of Hewlett Packard Enterprise. With HPE’s long history of innovation, current market-leading positions, and emphasis on culture and innovation, we couldn’t think of a better company to continue to forge the future for the technology and end-user value proposition. In addition to the dedication of our employees and support from investors, we want to thank our partners and customers for choosing our technology for their workloads.  And looking forward, we are excited to see how HPE takes Software-Defined Servers to the next level!  #softwaredefined # | 31 comments on LinkedIn

SDxCentral
Oct 13th, 2026
HPE Buys CloudPhysics, Rolls Out ‘Opportunity Engine’

HPE today announced the acquisition of CloudPhysics alongside the launch of its infrastructure recommendations engine.

Yahoo Finance
Oct 7th, 2026
HPE launches Gen13 servers with AMD EPYC CPUs for enterprise AI and agentic workloads

HPE unveiled four new ProLiant Gen13 Servers powered by 6th Generation AMD EPYC processors, designed to accelerate enterprise AI workloads whilst strengthening security and simplifying operations. The lineup includes the HPE ProLiant DL585a Gen13, supporting up to eight GPUs for AI inference and agentic AI workloads, and the compact DL525 Gen13 with up to 256 cores for high-throughput applications like fraud detection. Two OCP-compliant systems, the ProLiant XD245 and XD285, maximise compute density for data-intensive AI and HPC workloads through efficient shared power and cooling. The servers feature HPE iLO 8 with industry-first automatic self-encrypting drive capabilities and post-quantum cryptography readiness. HPE Compute Ops Management delivers 50% reduction in server management time. The DL525 launches later in 2026, with the DL585a following in early 2027.