Packaging Engineer E5
Posted on 3/22/2024
Applied Materials

10,001+ employees

Materials engineering for chips & displays
Company Overview
Applied Materials stands at the forefront of materials engineering for semiconductor and display manufacturing, offering a unique value proposition through its ability to engineer materials with precision at the atomic level, which is critical for the production of cutting-edge chips and advanced displays. Their expertise in scaling these processes to industrial volumes gives them a competitive edge, as it directly addresses the high-demand, fast-paced evolution of the tech industry. The company's commitment to enabling technological advancements positions it as a key player in shaping the future of electronics, making it an attractive workplace for those interested in contributing to the next wave of tech innovation.
Industrial & Manufacturing

Company Stage

N/A

Total Funding

$108.2M

Founded

1967

Headquarters

Santa Clara, California

Growth & Insights
Headcount

6 month growth

2%

1 year growth

7%

2 year growth

3%
Locations
Santa Clara, CA, USA • Albany, NY, USA
Experience Level
Entry
Junior
Mid
Senior
Expert
CategoriesNew
Hardware Engineering
Electronic Hardware Engineering
System Hardware Engineering
Requirements
  • Domain expertise in W2W hybrid and fusion bonding
  • Deep understanding of materials, process device physics, and integration
  • Experience with MES systems for 300mm Si processing is preferred
  • Strong communication skills
  • Ability to lead projects across organization and culture in a fast-paced environment
  • Self-starter, team player, and able to work independently with minimal supervision
Responsibilities
  • Developing new modules in Advanced Semiconductor Packaging
  • Driving new materials and process development to enable 3D NAND pitch scaling
  • Defining and developing differentiated modules for W2W hybrid bonding
  • Leading project across organization and culture in a fast-paced environment