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Full-Time

Packaging Engineer E5

Confirmed live in the last 24 hours

Applied Materials

Applied Materials

10,001+ employees

Materials engineering for chips and displays

Industrial & Manufacturing
Energy

Compensation Overview

$132k - $181.5kAnnually

+ Bonuses + Stock Awards

Expert

Santa Clara, CA, USA + 1 more

Category
Electronics Design Engineering
Electrical Engineering
Requirements
  • Domain expertise in W2W hybrid and fusion bonding
  • Deep understanding of materials, process device physics, and integration
  • Experience in W2W bonding specializing in 3D NAND or CIS
  • Experience with MES systems for 300mm Si processing
  • Strong communication skills
  • Ability to lead projects in a fast-paced environment
  • Bachelor's Degree in Electrical, Mechanical Engineering, Material Engineering or equivalent
  • 10-15 years of experience
Responsibilities
  • Developing new modules in Advanced Semiconductor Packaging
  • Driving new materials and process development for 3D NAND pitch scaling
  • Defining and developing differentiated modules for W2W hybrid bonding
  • Leading and maintaining Applied Materials roadmap in hybrid and fusion bonding
  • Working effectively with cross-functional teams
  • Leading projects across the organization

Applied Materials, a leader in materials engineering solutions, creates technologies that handle the complex process of production for new chips and advanced displays on an industrial scale. By expertly modifying materials at atomic levels, they provide a distinct competitive edge. This setting fosters a culture of innovation and precision, making it an ideal workplace for those keen on impacting future technologies and contributing to technological advancements that shape industries.

Company Stage

IPO

Total Funding

$111.2M

Headquarters

Santa Clara, California

Founded

1967