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Soitec

Engineered substrates for silicon-on-insulator wafers

Product Development Engineer

Process EngineeringUpdated on Nov 10
Full-timeBernin, FranceNo salary listedIn-person

About the Job

Requirements

  • A doctorate or, at minimum, an engineering diploma and five years of initial experience in microelectronics, semiconductor materials physics, or chemistry.
  • Ability to understand customer needs through interest in or knowledge of their applications.
  • Ability to account for constraints from multiple interfaces when developing solutions.
  • Proficiency in English sufficient for exchanges with equipment suppliers, partners, and teams in Singapore.

Responsibilities

  • Develop each manufacturing step individually and combine the steps to define the complete process.
  • Understand the physical effects of manufacturing processes on product quality.
  • Conduct experiments, analyze results, and adjust or refine the process iteratively.
  • Work in project mode with Pilot Engineering, expertise, product integration, Soitec Lab, Materials Engineering, industrial operations, and business-unit teams.
  • Contribute to customer satisfaction.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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