Principal Engineer Package Design

Key Responsibilities

• Package Design & Development:
  • Lead the design and development of new MOSFET packages, especially for lead frame based (e.g. DFN).
  • Lead frame and clip frame design experience is preferred.
  • Create detailed package models using 3D CAD software and define all critical dimensions, material stack-ups, and assembly drawings.
  • Optimize package designs for superior electrical performance (low RDS(on), low parasitic inductance/capacitance), thermal performance (low RthJC), and mechanical robustness.
• Simulation & Analysis:
  • Perform multi-physics simulations, including thermal (e.g., Ansys Icepak, SolidWorks Simulation), electrical (e.g., Q3D Extractor, HFSS), and mechanical stress analysis to predict and validate package performance.
  • Analyze simulation results to identify design trade-offs and drive design improvements.
  • Correlate simulation models with empirical data from lab characterization to ensure accuracy.
• Material Selection & Qualification:
  • Evaluate and select packaging materials, including leadframes, mold compounds, die-attach materials, and bonding wires, to optimize performance, reliability, and cost.
  • Work with suppliers to qualify new materials and processes.
• Cross-Functional Collaboration:
  • Collaborate closely with silicon design, test engineering, product engineering, and reliability teams to ensure package designs meet all product specifications.
  • Partner with PE and EE to develop robust manufacturing processes, troubleshoot yield issues, and ensure smooth new product introductions.
  • Interface with application engineers to understand customer requirements and translate them into package design criteria.
• Documentation & Process Improvement:
  • Maintain comprehensive design documentation, including specifications, simulation reports, and assembly procedures.
  • Contribute to the development of internal design rules, guidelines, and best practices for package engineering.
  • Stay current with industry trends, emerging packaging technologies, and competitive landscape.

Required Qualifications

• Education: Bachelor of Science (B.S.) in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field. A Master of Science (M.S.) is highly preferred.
• Experience:
  • 5+ years of direct experience in semiconductor package development, with a strong focus on power devices (MOSFETs or IGBTs).
  • Proven track record of successfully taking packages from concept through design, simulation, and high-volume manufacturing.
• Technical Skills:
  • Proficiency in 3D CAD software (e.g., AutoCAD, SolidWorks, Creo).
  • Strong understanding of semiconductor packaging processes, including die attach, wire bonding, and molding.
  • Deep knowledge of power semiconductor physics, including thermal management, parasitics, and failure mechanisms.
  • Familiarity with reliability testing standards and methodologies (e.g., JEDEC, AEC-Q101) for automotive and industrial applications.

Come join our global, inclusive & diverse team

Our purpose is to improve the quality of life of everyone we touch through our innovative motion systems. We are a truly global team bound together by our shared values. Our culture is built on the diversity, knowledge, skills, creativity, and talents that each employee brings to the company. Our people are our company’s most valuable asset. We are committed to providing an inclusive, diverse and equitable workplace where employees of different backgrounds feel valued and respected, regardless of their age, gender, race, ethnicity or religious background. We are committed to inspiring our employees to grow, act with ownership and find fulfilment and meaning in the work they do.

欢迎加入我们全球性、富包容和多元化的团队！

我们的目标是通过创新的驱动系统提高每一个产品接触者的生活质量。我们是一个真正的全球性团队，我们有着共同的价值观因而联结在一起。我们的文化是建基于每一位员工为公司带来的多样性、知识、技能、创意和才能之上。我们的员工是我们企业最宝贵的资产。我们致力于为员工提供一个包容、多元和平等的工作场所，在这里无论他们的年龄、性别、肤色、种族或宗教信仰如何，不同背景的员工都能感到受重视和尊重。我们致力于激励我们的员工成长，以主人翁精神行事，并在他们所做的工作中找到成就感和意义。