Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Associate Engineer - APS Product Support

Equipment Field ServiceConfirmed live in the last 24 hours

Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

Minimum qualification of a Vocational Certificate/NITEC in Electrical or Mechanical Engineering.
Minimum of 2 years of experience in the semiconductor or manufacturing industry.
Ability to work independently to troubleshoot and analyze machine and spares issues when needed.
Good written and communication skills.
Proficiency in Microsoft Office, including Excel, PowerPoint, and Word.

Responsibilities

Support technical activities for the repair and refurbishment of goods, ensuring quality and meeting schedule timelines.
Create repair and/or refurbishment work orders.
Expedite support and coordinate the replenishment of materials, and work with materials planners to proactively solve raw material issues.
Ensure materials are issued correctly as per work order.
Perform troubleshooting and diagnostics based on the Troubleshooting Guide.
Perform bonding and data collection based on Standard Work Instructions and Test Procedures, including approximately 2–4 hours of standing and microscope use.
Disassemble, assemble, and test Mechatronics Assemblies modules according to Standard Work Instructions and Test Procedures.
Update system records in a timely manner upon completion.
Support Agility Training for all Product Lines based on the Supervisor’s assignment.
Perform other duties as assigned.

Desired Qualifications

Basic knowledge of wire bonding and/or die bonding technology.

As an Associate Engineer in Product Support Organization, within the Aftermarket Products & Services (APS) Business Unit, this role is responsible for the technical activities that support the repair and refurbishment of goods. This includes the completion of the quality of goods meeting schedule timelines

Minimum qualification of Vocational Certificate/NITEC in Electrical or Mechanical Engineering
Minimum experience of 2 years in the semiconductor/ manufacturing industry
Basic knowledge of wire bonding and/or die bonding technology is preferred
Able to work independently to troubleshoot and analyze machines and spares issues when needed
Possess good written and communication skills
Proficient in Microsoft Office (Excel, PowerPoint and Words)

Company Overview

Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets.

Please refer to the website for more details: www.kns.com.

Equal Opportunity

Kulicke & Soffa recruits on the basis of merit (such as skills, experience or ability to perform the job), regardless of age, race, gender, religion, marital status and family responsibilities, or disability.

Create repair and/or refurbishment work orders.
Expedite support and coordinate the replenishing of materials and work with materials planners to proactively solve raw material issues.
Ensure materials are issued correctly as per work order.
Perform Troubleshooting and Diagnostic based on Troubleshooting Guide
Perform bonding and data collection based on Standard Work Instruction and Test Procedures (~2 - 4 hours standing and using microscope)
Disassembly, assembly and Testing of Mechatronics Assemblies module to Standard Work Instruction and Test Procedures.
Update system records in a timely upon completion.
Support Agility Training to all Product Lines based on Supervisor’s assignment.
Performs other duties as assigned.

About the Company

Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Singapore, Singapore
Founded: 1951

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