Manager – Compression Connector

Your Job

Molex is seeking an experienced Engineering Manager to build and lead a global engineering team responsible for expanding the ICMM memory connector portfolio. Reporting to Hung Liu, this leader will translate the ICMM memory strategy into an executable technology roadmap, a scalable organisation, and a disciplined product development engine serving AI, server, storage, networking, and high-performance computing platforms.

The role requires an entrepreneurial, hands-on technical leader who can establish capability quickly, engage customers and ecosystem partners, and deliver differentiated products in a technically demanding and highly cost-competitive market. Initial portfolio priorities include DDR5, DDR6, DIMM and SODIMM sockets, SOCAMM, and future modular memory interconnect architectures.

Our Team

The ICMM Engineering organisation develops interconnect, cable, memory, and magnetics solutions for global data centre, cloud, AI, storage, and networking customers. The Memory Solutions team will operate globally and work closely with Product Management, Sales, Signal Integrity, Manufacturing, Sourcing, Quality, Reliability, and Operations to move opportunities from architecture engagement through high-volume production.

What You Will Do

• Build, recruit, develop, and lead a high-performing global engineering team with the capability to design, validate, industrialise, and sustain next-generation memory connector products.
• Develop and execute the engineering roadmap for DDR5, DDR6, DIMM and SODIMM sockets, SOCAMM, and adjacent future memory interconnect technologies.
• Translate market trends, customer platform roadmaps, and ICMM business priorities into clear technology programmes, resource plans, and product development milestones.
• Lead product architecture, concept development, detailed design, simulation, prototyping, validation, qualification, and production readiness from opportunity through launch.
• Establish strong engineering practices, including design reviews, requirements management, DFMEA, tolerance analysis, design verification, reliability planning, and disciplined release control.
• Drive speed to market and early customer engagement to secure design-in positions for emerging memory architectures and next-generation compute platforms.
• Provide technical leadership across connector mechanics, contact systems, materials, plating, thermal performance, signal integrity, power integrity, durability, and high-volume manufacturability.
• Partner with customers, CPU and memory ecosystem participants, module suppliers, OEMs, ODMs, and internal commercial teams to understand architecture transitions and define differentiated solutions.
• Own engineering execution against programme scope, schedule, technical performance, cost, quality, and resource commitments, with timely escalation and transparent risk management.
• Embed design-to-cost and should-cost discipline from concept selection onwards, balancing performance, reliability, manufacturability, supply continuity, and competitive market pricing.
• Partner with manufacturing and sourcing teams to develop scalable, low-cost production solutions, supplier strategies, automation concepts, and robust launch plans.
• Lead technical problem-solving, failure analysis, root-cause investigation, and corrective actions during development, customer qualification, and production ramp.
• Create a culture of innovation, accountability, urgency, collaboration, and continuous improvement across locations and functions.
• Develop technical leaders and succession capability within the team while establishing clear roles, standards, performance expectations, and development plans.

Who You Are (Basic Qualifications)

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical discipline, or equivalent practical experience.
• Significant product development experience in connectors, interconnects, sockets, semiconductor hardware, server hardware, or an adjacent high-volume electronics industry.
• Proven experience building, managing, or significantly scaling engineering teams, ideally across multiple countries or design locations.
• Demonstrated success leading complex new product development from concept through validation, qualification, manufacturing launch, and production ramp.
• Strong technical understanding of precision connector design, contact systems, materials, tolerancing, reliability, and design for high-volume manufacturing.
• Ability to lead technically demanding customer discussions and convert ambiguous architecture needs into actionable product requirements and development plans.
• Commercial awareness and demonstrated ability to make sound trade-offs among technical performance, timing, cost, quality, risk, and manufacturability.
• Strong cross-functional leadership, executive communication, and influencing skills in a global matrix organisation.

What Will Put You Ahead

• Direct experience with DDR sockets, DIMM or SODIMM connectors, DDR6 development, LPCAMM, SOCAMM, compression connectors, or other memory attach technologies.
• Deep knowledge of high-speed signal integrity and power integrity, including channel performance, simulation, measurement, and design considerations for next-generation memory interfaces.
• Experience engaging hyperscale, AI infrastructure, server, storage, networking, CPU, memory, OEM, or ODM ecosystems during early platform definition and design-in cycles.
• Experience in Asian connector supply chains and low-cost, high-volume manufacturing environments, including tooling, stamping, plating, moulding, assembly, automation, and supplier development.
• Proven application of design-to-cost, should-cost analysis, value engineering, and costed-BOM ownership in a highly price-competitive market.
• Experience creating a new engineering capability, product line, or global technical organisation from an early-stage position.
• Master's degree in an engineering or related technical discipline.
• Mandarin and English communication capability for effective engagement with Asia-based customers, suppliers, and global internal teams.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

Who We Are

As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. The thousands of innovators who work for Molex have made us a global electronics leader. Our experienced people, groundbreaking products and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before.

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.

Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.