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Altera

FPGA and SoC provider with software

Physical Design Lead - Execution

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USAIn-person

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or a related field, plus 15+ years (Sr. Principal Engineer) or 12+ years (Principal Engineer) of physical design experience, including at least four full-chip tapeouts at advanced nodes with direct execution ownership.
  • A strong physical design execution track record with direct accountability for schedule and quality outcomes across blocks and full chip.
  • Demonstrated ability to deliver under schedule pressure without compromising quality, including experience managing critical-path recovery.
  • Hands-on expertise across the physical design flow, including floorplanning, placement, clock-tree synthesis, routing, and timing and power closure, and understanding of how these interact with signoff.
  • Hands-on proficiency with industry-standard implementation and signoff tools such as Synopsys Fusion Compiler, ICC2, PrimeTime, Cadence Innovus, Tempus, Voltus, Ansys RedHawk-SC, Siemens Calibre, or equivalent; experience with every listed tool is not required.
  • Working command of horizontal signoff flows that gate tapeout, including timing closure (static timing analysis), EMIR, physical verification, formal equivalence, and low-power verification.
  • Scripting and automation proficiency in Python, Tcl, Perl, or shell sufficient to build and debug execution tooling, not only to run it.
  • Experience driving execution on highly complex designs with concurrent block teams across multiple sites.
  • Demonstrated ability to engage senior customers, build rapport, and navigate challenging technical conversations with credibility, diplomacy, and influence.
  • Strong organizational and cross-team coordination skills, with a track record of resolving conflicting priorities across design teams.
  • Experience communicating and presenting to engineering teams and senior internal and external stakeholders.

Responsibilities

  • Drive day-to-day physical design execution and delivery across blocks and full-chip integration, from floorplan through tapeout.
  • Own the schedule and quality bar for physical design execution, proactively identifying risks and driving mitigation before milestones are threatened.
  • Coordinate execution across multiple blocks and design teams, resolving conflicts and dependencies so full-chip closure stays on track.
  • Grow into ownership of full-chip implementation scope, building the technical judgment and organizational relationships that responsibility demands.
  • Engage senior customer technical stakeholders directly, building rapport and navigating challenging technical conversations with credibility, diplomacy, and influence.
  • Serve as the escalation point for execution blockers, driving fast, pragmatic resolution under schedule pressure.
  • Partner with methodology and CAD teams to ensure execution practices remain aligned with signoff standards and quality gates.
  • Mentor physical design engineers on execution best practices, prioritization, and schedule management.

Desired Qualifications

  • Experience serving as an implementation lead or execution owner for a full chip or major subsystem.
  • Direct experience representing physical design execution in customer-facing technical reviews.
  • Working familiarity with physical-design signoff methodology, including EMIR, timing, and power, sufficient to partner effectively with methodology teams.
  • Experience mentoring or informally leading execution teams without formal management authority.

About the Company

Altera

FPGA and SoC provider with software

Altera designs and manufactures FPGAs and SoCs, along with software tools for hardware design and deployment. Customers can configure these programmable chips after fabrication to fit specific applications, helping them reach market faster and optimize performance. The company differentiates itself by offering a broad configurable silicon platform and a dedicated design software suite as an independent provider after its separation from Intel. Its goal is to deliver high-performance, adaptable processing solutions for industries like automotive, aerospace, communications, AI, cloud, and edge computing.

Company size
Not listed
Company stage
IPO
Headquarters
San Jose, CA
Founded
1983

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