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Black Semiconductor

Graphene photonics enable optical chip interconnects

Graphene Photonics Device Reliability Testing Engineer

Hardware Validation & TestingUpdated on Nov 7
Full-timeAachen, GermanyHybrid

About the Job

Requirements

  • A Ph.D. or Master’s degree in Electrical Engineering, Physics, Materials Science, or Photonics Engineering is required.
  • Hands-on experience in semiconductor device physics, optoelectronics, or reliability engineering is required.
  • Hands-on experience in photonic device characterization and reliability testing is required.
  • Experience with semiconductor failure analysis is required.

Responsibilities

  • Design and execute wafer-level device reliability test plans for graphene-based photonic devices, including DC bias, RF endurance, thermal cycling, and long-term stability.
  • Identify and investigate the physical mechanisms of graphene-related failure modes.
  • Characterize and monitor key performance metrics, including extinction ratio, insertion loss, bandwidth retention, energy efficiency, dark current stability, and responsivity degradation over device lifetime.
  • Drive structured root cause investigations using FMEA and 8D methodologies, and feed findings back to Design and Process teams.
  • Work with product and quality teams to achieve compliance with industry standards (JEDEC, OIF, IEC, and IEEE) and generate qualification and reliability documentation.

Desired Qualifications

  • Experience with high-speed RF testing above 40 GHz and VNA-based S-parameter measurements is desirable.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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