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Micron Technology

Makes memory and storage chips for AI and PCs

Front End Central Product Integration - Multiple Teams

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's, Master's, or PhD degree in Electrical Engineering, Materials Engineering, Materials Science, Physics, or Chemical Engineering, or more than 10 years of experience in a process-related role in the semiconductor industry.
  • More than 7 years of relevant industry experience and knowledge.
  • Logical thinking and knowledge of semiconductor fabrication process flows, interactions among processes, and how changes affect yield, device performance, and reliability.
  • Understanding of DRAM and NAND operation and structure to interpret parametric, probe, and qualification data from front-end and backend assembly processes.
  • Model-based problem solving, data-driven decision making, and presentation skills.
  • Proven ability to troubleshoot and solve structure- and device-related issues and identify root causes.
  • Organizational capabilities and ability to work effectively, be flexible with job responsibilities, and take initiative to assume added responsibilities.
  • Ability to travel to Micron sites as necessary for face-to-face collaboration.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.

Responsibilities

  • Lead process integration structural uniformity and cross-loop integration for critical modules, including the capacitance loop, and own end-to-end integration strategies to resolve yield, quality, and reliability gaps.
  • Drive physics- and process-based integration solutions in collaboration with cross-module process owners, process integration subject-matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.
  • Develop and apply model-based root cause analysis frameworks covering transport, reaction kinetics, pattern density, and geometry-dependent effects to diagnose structural non-uniformity.
  • Define, implement, and continuously strengthen critical inline monitoring and defence lines, including critical dimension, film loss, mass delta, defectivity, and edge/periphery metrics, to control structural uniformity.
  • Own and advance product integration programs and loop-level domain expertise, maintaining technical knowledge across node transitions.
  • Drive node-over-node shift-left integration, including early implementation of uniformity, bevel, and backside best-known methods during development phases to accelerate whole-wafer centre-to-edge yield and quality ramp.
  • Lead global projects, standardize and leverage network best-known methods, and scale proven solutions across sites.
  • Identify efficiency and performance gaps, and lead business process creation, optimization, and re-engineering to improve benchmark performance, cycle time, and development productivity.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled enhancements within the scope of work as part of continuous improvement.

Desired Qualifications

  • Strong interpersonal skills and ability to build customer and co-worker relationships.
  • Demonstrated teamwork skills and focus on developing effective team dynamics.
  • Ability to multitask and communicate verbally and in writing.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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