SiTime

Fabless MEMS timing solutions provider

Package Development Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-time

About the Job

Requirements

A bachelor's, master's, or PhD degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
At least 5 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of QFN/LGA and flip-chip bonding technologies.
In-depth understanding of packaging process flows, equipment, and materials such as photoresists, polymers, solders, and underfills.
Proficiency in statistical analysis software such as JMP or Minitab and data interpretation.
Experience with failure analysis techniques such as scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), optical microscopy, and X-ray.
Fluency in English.
Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.

Responsibilities

Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing, and flip-chip bonding processes.
Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
Perform root cause analysis and implement corrective and preventive actions using the 8D methodology for process-related issues and defects.
Collaborate with research and development, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
Provide technical support and training for manufacturing operators and technicians.
Stay updated with the latest industry trends and advancements in packaging technologies.
Work onsite at outsourced semiconductor assembly and test facilities 60% of the time in Bangkok/Ayutthaya, with 10% travel in Asia and the United States.

Desired Qualifications

Strong problem-solving skills and a data-driven approach to decision-making.
Excellent communication, interpersonal, and teamwork skills.

About SiTime

SiTime is the Precision Timing company.

Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.

Job Summary

We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Thailand, focusing on QFN/LGA assembly technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands-on engineer to make a significant impact on cutting-edge semiconductor packaging technologies within a dynamic and innovative environment.

Responsibilities:

Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing and flip-chip bonding processes…
Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues and defects.
Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
Provide technical support and training for manufacturing operators and technicians.
Stay updated with the latest industry trends and advancements in packaging technologies.
60% OSATs onsite (in Bangkok/Ayutthaya), 10% travel (Asia/US).

Qualifications & Requirements:

Bachelor, Master to PhD's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
Minimum of 5 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of QFN/LGA and Flip-chip bonding technologies.
In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
Strong problem-solving skills and a data-driven approach to decision-making.
Excellent communication, interpersonal, and teamwork skills.
Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.
Fluency in English is required.

Compensation Range:

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.

SiTime is committed to providing equal employment opportunities to all employees and applicants. Employment decisions are based on qualifications, merit, and business needs. We do not discriminate on the basis of any characteristic protected by applicable law.

Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.

About the Company

SiTime

Fabless MEMS timing solutions provider

SiTime designs MEMS-based timing solutions (oscillators, network synchronizers, and jitter cleaners) as a fabless semiconductor company. MEMS resonators on silicon replace quartz to generate precise clocks and synchronize networks, with manufacturing handled by third-party foundries. The approach offers smaller size, lower power consumption, and better temperature stability, supported by scalable, design-focused development rather than in-house fabrication. Its goal is to expand MEMS timing adoption across automotive, industrial, IoT, mobile, aerospace, and telecom markets worldwide.

Company size: 501-1,000
Company stage: IPO
Headquarters: Santa Clara, CA
Founded: 2005

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