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ASM International

Semiconductor deposition equipment and ALD tech

Senior Engineer 2 - Mechanical Engineering

Design EngineeringConfirmed live in the last 24 hours
Full-timePhoenix, AZ, USANo salary listed

About the Job

Requirements

  • A Master's degree in Mechanical Engineering or a related discipline is required.
  • Experience using multiple computer-aided design (CAD) programs is required.
  • Ability to iterate quickly through design concepts until a final design is settled is required.
  • Ability to generate robust manufacturing drawings for components using geometric dimensioning and tolerancing (GD&T) is required.
  • Knowledge of manufacturing techniques for machined components, sheet metal, and weldments is required.
  • Ability to read and design schematics, specifically piping and instrumentation diagrams (P&ID), is required.
  • Willingness to test one's own designs and identify opportunities for continuous improvement is required.
  • Knowledge of electrical, radio frequency (RF), or plasma systems, or a genuine desire to learn, is required.
  • Experience working with and on semiconductor tools in a fabrication (FAB) environment is required.
  • Ability to work with cross-functional teams in a fast-paced, dynamic environment is required.
  • Ability to work independently toward personal and organizational success is required.
  • Ability to communicate thoroughly and concisely is required.
  • Ability to lead and teach junior engineers critical principles and concepts is required.

Responsibilities

  • Design and develop mechanical systems and components for semiconductor equipment using engineering principles, product specifications, and research data.
  • Perform structural, thermal, and fluid dynamics engineering calculations to support robust and reliable designs.
  • Create and maintain Creo Parametric 3D computer-aided design models and detailed drawings, from individual parts to complex assemblies.
  • Evaluate the feasibility of product proposals, resolve technical issues, and develop new designs compliant with product safety and design standards.
  • Manage Continuous Improvement Projects (CIPs) and communicate clearly across teams and with external partners.
  • Prepare clear, complete engineering documentation for prototype builds, manufacturing, and product testing.
  • Support engineering project activities, including report preparation, schedule planning, design reviews, and coordination with cross-functional teams.
  • Establish product configurations and structures for new products and features in development and manufacturing environments.
  • Participate in and present at design reviews for new designs, product enhancements, and customer-specific solutions.
  • Support hardware development, installation, and testing to verify performance; create, review, and approve test plans and test procedures.
  • Interface with manufacturing, suppliers, and other engineering teams to support smooth product transfer into the manufacturing cycle.
  • Review and process engineering change requests and orders (ECR/ECO) and support continuous product and process improvements.
  • Travel to customer or supplier sites as needed to support technical discussions and project execution.
  • Maintain a strong commitment to safety in all activities.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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