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ASM International

Semiconductor deposition equipment and ALD tech

Principal Field Process Engineer

Design EngineeringConfirmed live in the last 24 hours
Full-timeHillsboro, OR, USANo salary listed

About the Job

Requirements

  • A Master's or PhD in Chemistry, Chemical Engineering, Materials Science, Physics, or a related field is required.
  • Seven to ten years of experience in thin-film deposition using atomic layer deposition (ALD) is required.
  • Strong expertise in semiconductor device integration, vacuum systems, film metrology, and structured problem solving is required.
  • The candidate must be able to independently design experiments, manage escalations, and influence without authority.
  • Strong technical communication skills and intellectual property awareness are required.
  • Flexibility to travel and support extended hours during qualifications or escalations is required.

Responsibilities

  • Own technical delivery and escalation for new product introductions of advanced deposition processes and hardware, including thermal ALD, plasma ALD, and area selective deposition.
  • Lead complex troubleshooting, root cause analysis, and cross-functional resolution with customers, Business Units, and field teams.
  • Drive on-site process and hardware development, including design of experiments-based experiments and continuous improvement initiatives.
  • Identify and advance new ASM technology and film opportunities aligned to customer roadmaps.
  • Lead process transfer to high-volume manufacturing fabs and develop and transfer Best Known Methods to service and manufacturing teams.
  • Capture and provide technical learnings to influence future ASM hardware, process, and qualification packages.

Desired Qualifications

  • Hands-on experience with ASM ALD, plasma-enhanced ALD, plasma-enhanced chemical vapor deposition, epitaxy, or vertical furnace low-pressure chemical vapor deposition equipment.
  • Demonstrated success optimizing deposition processes in development.
  • Experience leading customer-facing technical discussions or escalations.
  • Experience coordinating cross-functional action plans during escalations.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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