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Xscape Photonics

Develops photonics solutions for AI hardware

Laser Module Technical Lead

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USANo salary listedIn-person

About the Job

Requirements

  • A Master of Science or PhD in Photonics, Optical Engineering, Electrical Engineering, Physics, or a related field is required.
  • For Principal level, 12–15+ years of experience with demonstrated technical leadership is required.
  • Deep understanding of semiconductor lasers and laser module integration is required.
  • Experience integrating lasers with silicon photonic photonic integrated circuits is required.
  • Strong knowledge of optical packaging, fiber coupling, alignment, and assembly processes is required.
  • Experience with laser control electronics, thermoelectric cooler control, and monitoring photodiodes is required.
  • Familiarity with optical communication systems and module-level performance metrics is required.
  • Experience leading cross-functional engineering teams through product development is required.

Responsibilities

  • Own the overall architecture and system performance of laser module products.
  • Define module-level requirements, interface specifications, and performance budgets.
  • Allocate optical, electrical, thermal, and mechanical performance targets across subsystem owners.
  • Lead integration of semiconductor lasers, semiconductor optical amplifiers, silicon photonic photonic integrated circuits, optical isolators, filters, fiber interfaces, driver electronics, control circuitry, firmware for laser monitoring and control, mechanical packaging, and thermal solutions.
  • Define characterization plans for optical power, wavelength, linewidth, side-mode suppression ratio, relative intensity noise, polarization, coupling efficiency, and thermal performance.
  • Lead system-level debugging and root-cause analysis of optical, electrical, and thermal issues.
  • Drive design tradeoffs balancing performance, manufacturability, reliability, and cost.
  • Work with laser, photonic integrated circuit, firmware, electrical, mechanical, and manufacturing teams to achieve system performance goals.
  • Collaborate with external suppliers on component specifications, qualification, and manufacturing readiness.
  • Support product qualification, reliability testing, and transfer to volume manufacturing.

Desired Qualifications

  • Experience with external cavity and narrow-linewidth lasers is preferred.
  • Experience with high-speed optical transmit engines is preferred.
  • Experience with co-packaged optics is preferred.
  • Experience with 400G, 800G, or 1.6T optical modules is preferred.
  • Experience with passive optical alignment and active alignment techniques is preferred.
  • Experience with automated manufacturing and production test development is preferred.
  • Experience with reliability qualification and failure analysis is preferred.

About the Company

Xscape Photonics

Develops photonics solutions for AI hardware

Xscape Photonics develops photonics-based hardware to boost AI, ML, and simulation performance. Its products are light-based hardware and related services that deliver high bandwidth and low energy use, enabling faster data processing for AI models and HPC workloads. The company differentiates itself through a strong leadership team grounded in quantum and nonlinear photonics, a focus on scalable, high-performance photonics solutions, and a collaboration-driven approach that serves tech companies, research institutes, and industries needing advanced computing power. Its goal is to accelerate the adoption of photonics in AI and HPC by delivering reliable, scalable, energy-efficient photonic hardware and expertise.

Company size
51-200
Company stage
Series A
Total funding
$94M
Headquarters
Fort Lee, VA
Founded
2022

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