M

Micron Technology

Makes memory and storage chips for AI and PCs

Senior Advanced Packaging Technology Development Engineer - Bonding process

Manufacturing & Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A master's degree or higher in Chemistry, Physics, Materials, or a related engineering science field is required; a PhD is a plus.
  • At least two years of experience in bonding-related work is required.
  • Solid understanding of WSS and bonding technologies, including at least one of temporary bonding/debonding, hybrid bonding, or fusion/direct wafer bonding, is required.
  • Knowledge of bonding mechanisms, including surface activation, adhesion physics, interface energy, thermo-compression, and plasma-assisted bonding, is required.
  • Hands-on experience with bonding-related tools such as SUSS, EVG, or TEL is a plus.
  • Fluent communication in English and Chinese is required.
  • Ability to integrate AI-assisted tools into daily work responsibly and effectively, and to identify, test, and share AI-enabled improvements.

Responsibilities

  • Drive HBM process development and yield improvement in the WSS process.
  • Assist research and development of advanced packaging technologies, including chip stacking, 2.5D, and 3D packaging.
  • Support on-site project execution and make decisions as a technical consultant.
  • Troubleshoot complex problems, perform root cause analysis, and resolve process engineering issues.
  • Generate internal and external documentation, presentations, and technical reports.
  • Align daily work with department and organizational goals and Technology Development needs.
  • Contribute expertise in materials characterization through cross-team project engagement.
  • Coordinate mechanical characterization for global advanced packaging development efforts, including sites in the United States, Japan, and Singapore.
  • Recommend test structures and test vehicle designs for material property evaluation.
  • Review, summarize, and present data with recommendations for materials, and lead discussions with packaging material suppliers to meet technology roadmaps.
  • Identify, test, and share AI-enabled improvements within the role's scope and use AI tools for research, analysis, content creation, problem-solving, and operational tasks in compliance with organizational standards and legal requirements.

Desired Qualifications

  • A PhD is a plus.
  • Hands-on experience with bonding-related tools such as SUSS, EVG, or TEL is a plus.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs