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AttoTude

Photonic interconnects powering AI data centers

DSP Integration Test Engineer

Telecommunications EngineeringConfirmed live in the last 24 hours
Full-timeMenlo Park, CA, USANo salary listedIn-person

About the Job

Requirements

  • A Master of Science in Electrical Engineering is required; specialization in high-speed electronic or electro-optic communication systems is expected.
  • At least 5 years of relevant industry experience with an MSEE, or at least 3 years with a PhD.
  • Experimental experience bringing up high-speed DSPs and maturing their hardware, in coherent systems such as QPSK, 16QAM, or 64QAM, or multi-level PAM systems such as PAM4.
  • Foundational understanding of transmit- and receive-side DSP blocks, particularly equalizers such as FFE, DFE, and MLSE, their tradeoffs, and clock and carrier recovery.
  • Hands-on experimental experience measuring high-speed DACs and ADCs.
  • Experience developing calibration methods and transferring them to manufacturing test.
  • Experience developing and/or testing DSP-based control loops.
  • Performance validation and productization experience, including transfer to volume production.
  • Proficiency with high-speed laboratory equipment, including real-time and sampling oscilloscopes, BERTs, arbitrary waveform generators, and spectrum and phase-noise analyzers.
  • Programming experience in Python and Matlab for laboratory automation, modeling, and data analysis.
  • Ability to communicate complex information clearly and concisely across multiple platforms and modalities.
  • Ability to collaborate and support teammates and colleagues.

Responsibilities

  • Bring up and mature high-speed DSPs on prototype and production hardware, including transmit and receive data-path configuration, link optimization, troubleshooting, and debugging.
  • Characterize and optimize transmit and receive DSP blocks, including feed-forward and decision-feedback equalizers, MLSE, and clock (timing) recovery, and assess performance, complexity, and power tradeoffs.
  • Measure high-speed DACs and ADCs, including ENOB, SNDR, linearity, interleaving spurs, bandwidth, jitter, and phase noise, and quantify their impact on modem SNR and BER.
  • Develop calibration methods and transfer them to automated manufacturing test.
  • Develop and test DSP-based control loops, including adaptation convergence, loop stability, tracking, and robustness across process, voltage, and temperature.
  • Analyze link performance, including pre-FEC BER and SNR, and correlate measurements with system models.
  • Develop Python-based laboratory automation for testing, characterization, and data analysis.
  • Drive performance validation and qualification, and transfer DSP configurations, calibrations, and test procedures to volume production.
  • Feed experimental results back into architecture, design, and manufacturability decisions through interactions with DSP design, DiAx cable design, firmware/controls, and hardware teams, and help transition performance gains into the product.

Desired Qualifications

  • Prior work experience with coherent optical modules or 224 Gbps/PAM4 AEC modules.
  • Familiarity with related industry standards such as OIF 400ZR/800ZR, OIF CEI-224G, and IEEE 802.3dj.
  • Understanding of forward error correction, such as RS/KP4 and soft-decision FEC, and its interaction with DSP performance.
  • Experience characterizing RF and mm-wave components, such as S-parameters and nonlinear compression, and modeling linear and nonlinear signal impairments.
  • Familiarity with module management and telemetry interfaces such as CMIS, and firmware-based monitoring.
  • Familiarity with RTL/Verilog or hardware-oriented algorithm implementation.
  • Fluency with statistical analysis methods and software repositories such as GitHub, GitLab, Bitbucket, and Docker.
  • A PhD in Electrical Engineering or Applied Physics.

About the Company

AttoTude

Photonic interconnects powering AI data centers

AttoTude designs and sells advanced interconnect technology for data centers, focusing on AI workloads. Its main products are photonic interconnect solutions built on photonic integrated circuits and optical communications that move data at very high speeds with low bottlenecks. These interconnects connect servers, switches, and storage to enable high-speed parallel processing and supercomputing, reducing latency and increasing bandwidth in large-scale deployments. The company differentiates itself by concentrating on photonics-based networking to address AI-specific data center bottlenecks, serving large operators and enterprises through direct sales and licensing. Its goal is to help data centers scale AI capabilities efficiently by providing reliable, high-performance interconnects that support demanding workloads and future growth.

Company size
51-200
Company stage
Series C
Total funding
$131M
Headquarters
Menlo Park, CA
Founded
2024

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