Micron Technology

Makes memory and storage chips for AI and PCs

Dry Etch Staff/Principal Engineer - Advanced NAND

Process EngineeringConfirmed live in the last 24 hours

Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

Demonstrated aptitude for a research and development environment.
Three to ten years of experience in dry etch process development in research and development transferring to manufacturing.
Two to three years of relevant NAND, DRAM, or Logic module development experience, such as cross-functional team projects and deliveries.
Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena gained through experience and/or coursework.
Demonstrated leadership in problem solving and experience managing technical projects.
Understanding of various types of plasma dry etch reactors, including radio frequency sources and chemistries.
Expertise in statistical process control and analysis.
Experience solving scalability problems of deep high-aspect-ratio silicon/dielectric etches, with a fundamental understanding of advanced conventional and unconventional tailored pulsing schemes.
Demonstrated ability to lead supplier head-to-head evaluations.
Strong computer skills, including Microsoft Office and SAS software such as JMP or similar.
A Master's or PhD in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or relevant majors, with four to ten years of relevant dry etch process development experience; alternatively, a Bachelor's in these fields or relevant majors, with seven to twelve years of relevant experience.
Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contribute to continuous improvement by identifying, testing, and sharing AI-enabled enhancements within the scope of work.

Responsibilities

Lead dry etch unit process and critical module development.
Develop and innovate dry etch processes to meet structural and electrical specifications.
Collaborate with and lead cross-functional teams to solve complex structural problems.
Present process and technology roadmaps for current and future technology nodes.
Work on critical modules such as high-aspect-ratio etches, tier-by-tier etches, word-line contacts, and staircase structures.
Identify opportunities with other process areas and drive collaborative solutions.
Guide technology roadmaps in other process areas.
Lead or participate in cross-functional task forces driving toward a target.
Develop knowledge and expertise in other areas' process hardware or technologies.
Serve as a resource and mentor for dry etch peers in dry etch technology and/or project management.
Provide upper management with critical project-status and impact updates.
Work directly with process integration and other process areas, including wet etch, chemical vapor deposition, diffusion, metals, lithography, and chemical mechanical polishing.
Work with dry etch chambers and own the process roadmap to meet program and yield goals.

Desired Qualifications

Data science basics, Python coding, or AI coding experience are preferred over candidates without this experience.

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Staff/Principal Engineer, you will bea part ofrevolutionary Next Generation NAND research & development Dry Etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. You will workdirectly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on state of the art and best in class dry etch chambers & own the process roadmap to meet program and yield goals.Your responsibilities include, but not limited to:

Leading Dry Etch unit process and critical module development

Develop/innovate dry etch processes to meet structural and electrical specifications
Collaborate and lead cross functional teams to solve complex structural problems
Present process and technology roadmaps for current and future technology nodes
Associated with critical modules such as HAR, Tier by tier etches, WL contacts & staircase

Interaction with other Process Areas

Identify opportunities & drive towards a collaborative solution
Guide other areas technology roadmaps
Lead or be a part of cross functional task force groups driving towards a target
Develop basic knowledge tending to expertise in other areas process hardware, or technologies

Interaction with Dry Etch peers

Be a resource and mentor for peers in dry etch technology and/or project management
Provide critical updates to upper management on project status and impacts

Successful candidates for this position will have:

Demonstrated aptitude for a research and development environment
3-10 years’ experience in dry etch process development in R&D transferring to manufacturing
2-3 years of relevant NAND, DRAM or Logic module development experience, e.g.: cross-functional teams projects and deliveries
Knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
Demonstrated leadership in problem solving. Experience in managing technical projects
Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
Expertise in statistical process control and analysis
Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
Demonstrated ability to lead supplier head to heads
Data science basics / Python coding / AI coders shall be preferred over candidates without this experience
Strong computer skills, including MS Office, and SAS software like JmP and similar
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Education

Masters / PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 4-10 years of relevant dry etch process development experience
Bachelors (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with 7-12 years of relevant experience

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size: 10,001+
Company stage: IPO
Headquarters: Boise, ID
Founded: 1978

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