Teledyne
Manufactures sensors, imaging systems, and avionics
Buyer
Up to 20% domestic and international travel for supplier visits and business support activities.
About the job
- A bachelor's degree or 3 to 5+ years of purchasing experience in a manufacturing environment.
- Strong supplier management and negotiation skills.
- Experience interpreting bills of materials and engineering drawings.
- Knowledge of enterprise resource planning and material requirements planning systems.
- Experience managing Kanban replenishment systems and long-term purchase agreements.
- Advanced proficiency in Microsoft Excel, Word, PowerPoint, and Teams.
- Excellent communication, organizational, and problem-solving skills.
- Manage suppliers across quality, delivery, inventory, scheduling, and contract negotiations.
- Monitor and improve supplier performance related to cost, quality, and delivery.
- Coordinate procurement activities with production schedules.
- Resolve material shortages to support uninterrupted manufacturing operations.
- Source, evaluate, and select suppliers based on quality, cost, and delivery requirements.
- Negotiate pricing, terms, and long-term supply agreements.
- Drive cost reduction initiatives and process improvements.
- Maintain and report on open purchase orders, late deliveries, inventory coverage, and supplier performance metrics.
- Support engineering and new product development activities as needed.
- Experience with Microsoft AX.
- Experience with electronic components and printed circuit board assemblies.
About the company
Teledyne designs and manufactures sensors, imaging cameras, and electronics for aerospace, defense, environmental monitoring, and medical imaging. Its products combine core sensing and imaging capabilities into integrated solutions, including digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems for harsh environments. The company differentiates itself by growing through targeted acquisitions, building a diversified portfolio with specialized capabilities and high barriers to entry. Its goal is to expand capabilities and market reach by acquiring complementary technologies while delivering reliable sensing and imaging technology for critical industries.
Company Size
11-50
Company Stage
IPO
Headquarters
Thousand Oaks, California
Founded
1960
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Simplify's Take
What believers are saying
- July 22, 2026 revenue rose 9.8% and non-GAAP EPS rose 20.8%.
- Teledyne raised 2026 EPS guidance to $24.45-$24.65 after record orders.
- New FLIR deals with RNLI, STORM, and MentorAPM extend thermal imaging channels.
What critics are saying
- Defense demand drives results; any Pentagon budget reset hits Aerospace and Defense immediately.
- Acquired intangible amortization stayed $56.0 million in Q2, pressuring reported earnings.
- A major export-control or cyber breach would freeze FLIR and space imaging government sales.
What makes Teledyne unique
- Teledyne’s sensor stack spans FLIR thermal, space detectors, and underwater electronics across 2026.
- The July 22, 2026 quarter showed $5.0 billion backlog and 1.1x leverage.
- NASA Artemis II, Sentinel-3C, and FLEX prove mission-critical qualification across space programs.
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Benefits
Hybrid Work Options
Company News
MentorAPM adds thermal imaging to MentorLens(R) through Teledyne FLIR collaboration. * Rating12345 New integration to be showcased at SMRP adds another source of condition data to strengthen asset intelligence and support better asset decisions PHOENIX (Sept. 23, 2026) - MentorAPM, an end-to-end asset lifecycle and work management solutions provider and industry leader in AI-powered condition assessments, is expanding its asset intelligence capabilities with thermal imaging through a collaboration with Teledyne FLIR. The integration of the FLIR iXX-Series with MentorLens adds thermal data to the condition assessment process, giving asset-intensive organizations another source of information to better understand physical assets and support maintenance, reliability and asset management decisions. The new capabilities will be showcased at the Society for Maintenance & Reliability Professionals (SMRP) annual conference, Sept. 28-Oct. 1 in Raleigh, NC. "Our team has spent the past several years looking for ways to improve workflows for customers in asset-intensive organizations," said Tacoma Zach, co-founder and CEO of MentorAPM. "We've seen firsthand how MentorLens can significantly reduce the time required for condition assessments while delivering consistent, reliable data every time. Adding thermal imaging gives our customers another source of asset data to consider when making maintenance and reliability decisions. We're excited to share it with the SMRP community." In an industry where downtime can be costly, maintenance and reliability professionals are under increasing pressure to improve operational efficiency while navigating a growing number of AI tools. But AI is only as useful as the information and context behind it. By adding thermal information to MentorLens' AI-assisted visual condition assessments, teams can capture nameplate, visual condition and thermal information from the same device and bring it into the asset record. This helps build more complete and current asset information to support maintenance, reliability and asset management decisions. That information can feed into MentorAPM's native enterprise platform or work alongside an organization's existing EAM or CMMS, allowing teams to add asset intelligence without replacing their core system. MentorAPM will also give SMRP attendees a first look at Nelson, its asset-aware AI coworker, currently in beta ahead of a broader launch in 2027. Nelson brings asset intelligence into everyday maintenance and reliability workflows by helping users connect questions about individual assets with condition, risk and reliability information. Users can interact with their asset information in plain language to identify what needs attention, understand the context behind it and determine appropriate next steps. MentorAPM and Teledyne FLIR will present the integration together during an Innovation Lab session at SMRP, "From Camera to Asset Intelligence: AI Workflows for Reliability Teams," on Tuesday, Sept. 29, from 1:15-2:15 p.m. ET in Innovation Lab #3. Tacoma Zach will lead the session, with John Gould of Teledyne FLIR joining to discuss the iXX-Series and demonstrate how visual and thermal condition data can move from field capture into asset intelligence. Attendees can also see the integration at the MentorAPM booth #512 and FLIR booth #1307 throughout the conference. About MentorAPM MentorAPM provides asset intelligence software purpose-built for utilities and asset-intensive industries, helping organizations simplify complexity and make better decisions about critical infrastructure. Its solutions bring together asset data, asset performance management, work management and risk-based asset investment planning in a single platform - enabling teams to move from reactive maintenance to proactive, prioritized operations. The MentorAPM enterprise platform includes MentorLens(R), Risk & Criticality Analyzer, and Asset Investment Planner, solutions which can also be deployed independently. MentorLens is an AI-powered solution that transforms how asset data is captured and maintained - using simple field workflows to rapidly build accurate asset inventories and condition assessments from photos. By connecting asset condition, risk, and cost, MentorAPM helps organizations confidently prioritize work and capital investment, improve reliability, and extend the life of critical assets for sustainable and resilient operations. About Teledyne FLIR Teledyne FLIR, a subsidiary of Teledyne Technologies, is a world leader in intelligent sensing solutions for defense and industrial applications. Founded in 1978, the company creates advanced technologies that help professionals make better, faster decisions that save lives and livelihoods. Teledyne FLIR provides a diverse portfolio of thermal imaging, visible-light imaging, video analytics, measurement and diagnostic, and advanced threat detection systems serving customers across industrial, commercial, public safety, and defense markets.
Teledyne e2v introduces Nexora, its next-generation family of backside-illuminated global shutter CMOS image sensors. The Associated Press Sep 22, 2026, 3:02 AM Teledyne e2v's Nexora family of backside-illuminated global shutter CMOS image sensors. SEVILLE, Spain-(BUSINESS WIRE)-Sep 22, 2026- Teledyne e2v, a Teledyne Technologies (NYSE:TDY) company and global innovator of imaging solutions, today announced Nexora(TM), a new family of CMOS image sensors that delivers high sensitivity, high-speed imaging and low power consumption for demanding machine vision applications. Teledyne e2v's Nexora family of backside-illuminated global shutter CMOS image sensors. Available in 12 MP (4,096 by 3,072) and 16 MP (4,096 by 4,096) resolutions, in both monochrome and color versions, Nexora is designed for applications that require sharp images at very high speeds. These include high-resolution machine vision, intelligent traffic systems, and outdoor surveillance. At the heart of Nexora is Teledyne e2v's proprietary backside-illuminated (BSI) pixel technology. By positioning the photodiode closer to the incoming light and maximizing the light-sensitive area of each pixel, the sensor achieves higher light-collection efficiency than conventional front-side illuminated (FSI) architectures. This results in quantum efficiency (QE) of up to 73% at 550 nm and 15% at 940 nm, improving performance in challenging lighting conditions and near-infrared applications. The Nexora family also features Teledyne e2v's 3D-stacked sensor architecture, which integrates multiple functions within a compact, multilayer structure. This approach increases design flexibility while helping camera manufacturers develop smaller, higher-performance imaging systems. Nexora incorporates a versatile LVDS interface that is compatible with a wide range of FPGAs and image signal processors. It is housed in a compact 23 by 21.5 mm package that is compatible with 29 by 29 mm^2 cameras and standard C-mount optics. Rafael Romay, President of Teledyne Vision Solutions, said: "With Nexora, we focused on giving camera manufacturers a new platform that balances image quality, speed and integration simplicity. The result is a sensor family that can support a wide range of current and emerging machine vision applications." See Nexora at VISION in Stuttgart, Germany, Oct. 6-8, 2026. Visit us in Hall 8, Booth 8B10, or contact us online for more information. Documentation and samples are available now upon request. About Teledyne Vision Solutions Teledyne Vision Solutions offers the world's most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivalled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other's strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage. About Teledyne Teledyne Technologies Incorporated is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne's operations are primarily located in the United States, Canada, the United Kingdom, and Western and Northern Europe. For more information, visit Teledyne's website at teledyne.com. [email protected] KEYWORD: EUROPE GERMANY SPAIN INDUSTRY KEYWORD: SECURITY HARDWARE PHOTOGRAPHY TECHNOLOGY SOFTWARE PUB: 09/22/2026 02:00 AM/DISC: 09/22/2026 02:02 AM You May Also Like
Teledyne e2v has launched Nexora, a new family of CMOS image sensors designed for high-speed machine vision applications. The sensors are available in 12MP and 16MP resolutions, in both monochrome and colour versions. Nexora features proprietary backside-illuminated pixel technology, which positions the photodiode closer to incoming light, achieving quantum efficiency of up to 73% at 550nm and 15% at 940nm. This improves performance in challenging lighting conditions and near-infrared applications. The sensors utilise a 3D-stacked architecture that integrates multiple functions within a compact, multilayer structure. They come with a versatile LVDS interface compatible with various FPGAs and image signal processors. Target applications include high-resolution machine vision, intelligent traffic systems, and outdoor surveillance. Documentation and samples are now available upon request.
AI drones advance industrial inspection, Suntek unlocks new market opportunities. News highlights Sep 22, 2026, 08:00 0 Credit: Suntek Global Critical infrastructure across power generation, petrochemicals, and manufacturing plays a vital role in industrial operations. As equipment ages, ongoing maintenance and safety management become increasingly urgent. Because unexpected downtime carries enormous financial costs, facilities have traditionally relied on personnel entering energized switchyards, climbing transmission towers, or working in hazardous, confined spaces. However, this conventional approach is constrained by limited efficiency and exposes workers to significant safety risks. As AI-powered drones integrated with thermal imaging modules mature, industrial inspection is transitioning from episodic manual checks toward automated, continuous monitoring and predictive maintenance. Albert Wang, Business Development Manager of Suntek Global, pointed out that industries currently face a chronic shortage of certified thermographers and inspectors. Furthermore, manual inspections are episodic and subjective, with noticeable variance across inspectors evaluating the same anomalies, which often leads to inconsistent inspection accuracy. Consequently, industries are seeking autonomous inspection platforms equipped with thermal modules. Beyond keeping maintenance personnel out of high-risk environments, these systems deliver high repeatability through fixed flight paths, consistent viewpoints, and uniform time-of-day baselines. This enables enterprises to track asset degradation trends over time, upgrading traditional periodic audits into true predictive maintenance. Market research indicates that the global power-inspection drone market across all payloads is projected to expand from $2.8 billion in 2025 to $8.6 billion by 2034. Within this sector, thermal-imaging adoption already exceeds 59%, with the directly thermal-addressable slice expected to reach $5 billion by 2034. With nearly a decade of deep collaboration with Teledyne FLIR, Suntek serves as an ideal partner for Taiwan and global industry players looking to seize this substantial market opportunity. Detecting Subtle Thermal Signatures to Identify Faults Before Failure Before catastrophic failure occurs, equipment typically exhibits electrical faults, mechanical wear, or process anomalies, accompanied by subtle hotspots invisible to the naked eye. Utilizing thermal imaging allows operators to detect temperature anomalies early and schedule repairs proactively, minimizing downtime impacts. In particular, significant advances in uncooled long-wave infrared (LWIR) sensitivity now resolve fine temperature differentials into quantifiable data for actionable asset health analysis. Among key verticals, power and renewables represent prime deployment grounds for drone inspection. In solar operations, traditional manual thermography is labor-intensive; a single thermal-imaging drone can survey 1-2 MW of installed capacity per flight hour, compared with under 50 kW per hour using manual methods - delivering an order-of-magnitude leap in productivity. Mr. Wang further explained that when thermal imaging combines with edge AI, the system advances from basic imaging to intelligent automated interpretation - classifying defects, detecting anomalies at scale, and fusing multi-modal visible, thermal, and LiDAR inputs to alleviate the burden of manual image review. However, the core challenge lies in integrating sensors, calibration pipelines, drivers, edge computing, and AI models. Because thermal measurements are sensitive to ambient temperatures and optical characteristics, systems must ensure rock-solid radiometric stability. Currently, Teledyne FLIR provides radiometric variants including Boson+, Hadron 640R+, and the Lepton family, supplying system integrators with factory-calibrated, reliable thermal data. Nonetheless, integrating thermal cores into edge platforms involves complex hardware plumbing, such as MIPI CSI-2, USB, VoSPI, and V4L2 driver development, as well as frame synchronization between thermal and visible sensors - roadblocks that often stall OEM engineering teams for 6 to 12 months. To eliminate these hurdles, Suntek provides pre-integrated Reference Designs and validated drivers, helping equipment builders bypass tedious bottom-layer troubleshooting and compressing development timelines from quarters down to weeks. Eliminating Integration Hurdles from Core Components to Deployment With nearly a decade of continuous partnership with Teledyne FLIR, Suntek possesses deep tribal knowledge of Lepton and Boson architectures, addressing real-world calibration, driver, and manufacturing variations. Suntek provides dedicated carrier boards, driver integration, system engineering, and production support, significantly lowering the technical barrier for OEMs bringing thermal products to market. Suntek offers proven reference platforms across Boson+ and Lepton. Its compact MicroIR+ modular platform integrates a direct-mount Lepton socket, a quad-core RISC-V compute core, secure networking, and industrial production I/O onto a single validated board. Crucially, the platform utilizes an NDAA-compliant and ITAR-free BOM, meeting stringent cybersecurity and regulatory mandates for overseas critical infrastructure. In addition, addressing the reality that many innovators and startups begin with high-mix, low-volume (HMLV) runs of 100 to 5,000 units annually, Suntek provides comprehensive supply chain management and manufacturing support to bridge the gap from concept to commercial volume production. On October 28, 2026, Teledyne FLIR will host the "2026 Thermal Imaging AI Developer Forum," unveiling the next-generation Boson SX8 ultra-high-resolution thermal module and breakthrough solutions, empowering industry partners to accelerate deployment across autonomous drone inspection, smart manufacturing, critical infrastructure monitoring, and autonomous systems.
Teledyne Space Imaging's sensor technology launched aboard two European Space Agency Earth observation missions, Sentinel-3C and FLEX, on a Vega C rocket from French Guiana. Teledyne supplied five CCD55-20 detectors for Sentinel-3C's Ocean and Land Colour Instrument, which will map ocean colour, vegetation cover, and land use. Sentinel-3C is the third satellite in the Sentinel-3 series, part of the EU's Copernicus Earth observation programme. For the FLEX mission, Teledyne provided three CCD325 detectors designed to measure fluorescent signals from plants during photosynthesis. The data will help scientists understand plant health, carbon dioxide absorption, and ecosystem functioning. Teledyne Space Imaging has contributed to more than 250 space projects for agencies including NASA, ESA, JAXA, and KASA.