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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A Master's degree or above in Engineering, Science, or a related technical field.
  • Around 2 years of experience in the semiconductor industry.
  • Knowledge and practical experience in Lamination, Lapping/Grinding, and Laser Dicing processes.
  • Baseline digital fluency, with the ability to use AI-assisted tools to support research, analysis, content creation, problem-solving, or operational tasks relevant to the role.
  • Strong problem-solving, process improvement, and cross-functional collaboration skills.

Responsibilities

  • Leverage AI and advanced analytics tools to identify process variation, uncover hidden KPIVs, and accelerate root cause analysis.
  • Develop and deploy AI-assisted monitoring, anomaly detection, and predictive models to improve process stability, yield, and equipment performance.
  • Utilize digital solutions such as Copilot, Power BI, AI Agents, and dashboards to automate routine engineering analysis, reporting, and decision-making workflows.
  • Drive data-driven process optimization through machine learning, pattern recognition, and large-scale manufacturing data analysis.
  • Partner with Automation, IT, and Data Science teams to implement smart manufacturing solutions and AI-enabled process control methodologies.
  • Establish and maintain digital twins, predictive maintenance models, and AI-based early warning systems for process and equipment health monitoring.
  • Identify opportunities to reduce engineering cycle time through AI-assisted experiment design, data mining, and knowledge management platforms.
  • Lead AI adoption initiatives within the manufacturing organization to improve productivity, quality, cost, and operational efficiency.

Desired Qualifications

  • Hands-on experience in semiconductor assembly or backend processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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