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Micron Technology

Makes memory and storage chips for AI and PCs

Test Engineering Manager

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeSanand, IndiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Industrial Engineering, or a related technical discipline.
  • At least 8 years of experience in semiconductor manufacturing, test engineering, process engineering, product engineering, or related technical roles.
  • At least 2 years of experience leading engineering projects, technical teams, or people management responsibilities.
  • Strong understanding of semiconductor assembly and test manufacturing processes.
  • Experience with statistical analysis, process control, and problem-solving methodologies.
  • Ability to analyze complex technical problems and implement sustainable solutions.

Responsibilities

  • Lead, coach, and develop a team of Test Engineers and technical professionals.
  • Create an inclusive work environment that values diverse perspectives and collaboration.
  • Establish clear goals, priorities, and development plans aligned with organizational objectives.
  • Drive employee engagement, growth, accountability, and succession planning.
  • Support recruitment, onboarding, mentoring, and retention efforts.
  • Own daily engineering support for Component Test manufacturing operations.
  • Drive rapid issue resolution for process, equipment, yield, and quality excursions.
  • Establish robust process controls and manufacturing standards.
  • Ensure process capability and operational stability across manufacturing lines.
  • Partner with production teams to maximize equipment utilization, throughput, and operational efficiency.
  • Lead data-driven yield improvement initiatives.
  • Drive root cause investigations using structured problem-solving methodologies.
  • Implement corrective and preventive actions to eliminate recurring issues.
  • Partner with Quality and Product Engineering teams to improve outgoing product quality.
  • Support customer issue investigations and manufacturing risk assessments.
  • Lead engineering readiness activities for new products and technology nodes.
  • Execute process qualifications and manufacturing validations.
  • Assess manufacturing risks and develop mitigation plans.
  • Ensure smooth transition from development to high-volume production.
  • Collaborate with global engineering teams to deploy best practices.
  • Drive process optimization and continuous improvement initiatives.
  • Support equipment qualifications, upgrades, and technology transfers.
  • Partner with Equipment Engineering teams to improve performance and capability.
  • Establish standardized operating procedures and engineering specifications.
  • Lead equipment and process validations using statistical methodologies and risk-based approaches.
  • Utilize data analytics to identify trends, opportunities, and performance gaps.
  • Develop KPI dashboards and performance metrics.
  • Drive automation and digital transformation initiatives.
  • Leverage advanced analytics and AI-enabled tools where appropriate to improve decision-making and operational effectiveness.
  • Promote a strong safety-first culture.
  • Ensure compliance with company policies, environmental health and safety standards, and quality management systems.
  • Support audit readiness and regulatory compliance activities.
  • Drive continuous improvement in workplace safety and operational discipline.

Desired Qualifications

  • A master's degree in Engineering or a related technical field.
  • Experience in memory, storage, DRAM, NAND, SSD, or semiconductor backend manufacturing environments.
  • Knowledge of Component Test, Final Test, Burn-In, System-Level Test, or Automated Test Equipment operations.
  • Experience with JMP, Minitab, Python, Power BI, SQL, Tableau, or similar analytical tools.
  • Lean Six Sigma Green Belt, Black Belt, or equivalent continuous improvement certification.
  • Experience leading global cross-functional projects and technology transfers.
  • Knowledge of AI-assisted analytics, manufacturing automation, and digital factory initiatives.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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