SpaceX

Builds rockets and runs Starlink satellite internet

Process Engineer - Gold-To-Gold Interconnect & Flip Chip Assembly

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeBastrop, TX, USANo salary listed

About the Job

Requirements

A bachelor's degree in Chemical Engineering, Materials Science, Mechanical Engineering, or another engineering discipline.
At least 2 years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience; internship or extracurricular experience is applicable.
At least 3 years of hands-on IC assembly or advanced packaging experience, including direct gold-to-gold interconnect or similar gold-based interconnect work is preferred.
Hands-on thermosonic flip-chip bonding and gold stud bumping, gold bumps, or gold-to-gold interfaces are preferred.
Experience with vacuum mold lamination or advanced encapsulation using mold sheets, thermally conductive or epoxy molding compounds, or underfills is preferred.
Understanding of plasma and surface preparation, organic, ceramic, leadframe, or wafer-level substrates, warpage, coefficient of thermal expansion mismatch, thermo-mechanical stress, adhesion, and delamination is preferred.
Experience with design of experiments, statistical process control, Cp/Cpk, root-cause analysis, failure mode and effects analysis, Six Sigma, and control plans is preferred.
Experience with inspection and metrology methods including X-ray, scanning acoustic microscopy, optical microscopy, profilometry, and cross-section analysis, and interconnect characterization including contact resistance, shear/pull, and bond integrity is preferred.
Experience with package reliability testing and JEDEC or IPC standards, and supporting outsourced semiconductor assembly and test providers or contract manufacturers through development, qualification, and production ramp is preferred.
AutoCAD and familiarity with simulation tools such as ANSYS, COMSOL, or similar tools are preferred.
Data analysis experience using JMP, Minitab, MATLAB, or Python is preferred.
Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor is preferred.
Must work onsite in Bastrop, Texas; the position is not remote or hybrid.
Must be willing to travel up to 20% domestically and internationally for supplier and manufacturing support.
Must be willing to work extended hours or weekends to support key milestones.
Must be able to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks, including lifting up to 25 pounds and handling wafers, substrates, packages, tooling, and assembly samples.
Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management are required.
Must be a U.S. citizen or national, U.S. lawful permanent resident, refugee, or asylee, or be eligible to obtain the required U.S. Department of State authorizations.

Responsibilities

Develop and qualify gold-to-gold interconnect and thermosonic flip-chip/die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows using design of experiments to control bond integrity, contact resistance, and mechanical strength.
Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability.
Develop and optimize vacuum mold lamination and related encapsulation, including material selection, vacuum, temperature, pressure, time, and cure; troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed.
Support related assembly steps as needed, including wafer and die handling, placement, plasma and surface cleaning, underfill, reflow, singulation, laser marking, and inspection.
Select and characterize assembly materials, including adhesives, mold compounds, substrates, and interconnect materials, for their impact on bond strength, adhesion, thermal performance, warpage, and reliability.
Specify, evaluate, install, and qualify assembly equipment, including flip-chip bonders, thermosonic bonders, vacuum laminators, plasma tools, and inspection tools, with suppliers.
Run design-of-experiments studies, capability studies, and statistical process control on critical parameters; write process specifications, work instructions, control plans, failure mode and effects analyses, and qualification reports.
Drive new product introduction from prototype through qualification and production release; perform root-cause analysis and support failure analysis using X-ray, scanning acoustic microscopy, optical inspection, cross-section analysis, and scanning electron microscopy.
Correlate process settings with electrical, mechanical, and reliability results; apply design for manufacturability and own schedules, risks, and production readiness for assigned technologies.

Desired Qualifications

Hands-on thermosonic flip-chip bonding and gold stud bumping, gold bumps, or gold-to-gold interfaces.
Vacuum mold lamination or advanced encapsulation using mold sheets, thermally conductive or epoxy molding compounds, or underfills.
Understanding of plasma and surface preparation, organic, ceramic, leadframe, or wafer-level substrates, warpage, coefficient of thermal expansion mismatch, thermo-mechanical stress, adhesion, and delamination.
Design of experiments, statistical process control, Cp/Cpk, root-cause analysis, failure mode and effects analysis, Six Sigma, and control plans.
Inspection and metrology using X-ray, scanning acoustic microscopy, optical microscopy, profilometry, and cross-section analysis; interconnect characterization including contact resistance, shear/pull, and bond integrity.
Package reliability testing and JEDEC or IPC standards, and experience supporting outsourced semiconductor assembly and test providers or contract manufacturers through development, qualification, and production ramp.
AutoCAD and familiarity with simulation tools such as ANSYS, COMSOL, or similar tools.
Data analysis using JMP, Minitab, MATLAB, or Python.
Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor.

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

PROCESS ENGINEER, GOLD-TO-GOLD INTERCONNECT & FLIP-CHIP ASSEMBLY (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth.

We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners.

RESPONSIBILITIES

Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength
Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability
Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed
Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection
Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability
Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers
Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports
Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies

BASIC QUALIFICATIONS

Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable)

PREFERRED SKILLS AND EXPERIENCE

3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination
DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp
CAD (AutoCAD) and familiarity with simulation tools (ANSYS, COMSOL, or similar) is a plus; data analysis with JMP, Minitab, MATLAB, or Python is a plus
Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor

ADDITIONAL REQUIREMENTS

Onsite in Bastrop, TX (not remote or hybrid)
Up to 20% domestic and international travel for supplier and manufacturing support
Willingness to work extended hours or weekends to support key milestones
Ability to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks (including lifting up to 25 lbs and handling wafers, substrates, packages, tooling, and assembly samples)
Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management

ITAR REQUIREMENTS:

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to [email protected].

About the Company

SpaceX

Builds rockets and runs Starlink satellite internet

SpaceX builds and launches reusable rockets and spacecraft for NASA, the military, and companies, and it runs Starlink, a satellite internet service for homes and businesses. In 2020, its Dragon capsule became the first privately built spacecraft to carry astronauts to the International Space Station. Its Falcon 9 rocket lands its first stage so the booster can fly again, which cuts launch costs, while Starlink beams internet from low-orbit satellites to small dishes for a monthly fee. SpaceX also owns xAI, maker of the Grok chatbot and owner of the social network X, and is building Starship, a fully reusable rocket meant to carry people to the Moon and Mars. Elon Musk founded SpaceX in 2002, and it is based in Starbase, Texas.

Company size: 10,001+
Company stage: IPO
Headquarters: Starbase, Texas
Founded: 2002

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