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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – Process Development

Manufacturing Engineering +1Confirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor, or a related Engineering discipline.
  • Zero to two years of experience in semiconductor packaging, assembly, or process integration.
  • Strong data analysis, statistical analysis, and data interpretation skills.
  • Ability to make sound data-driven decisions and prioritize and apply due diligence to day-to-day tasks.
  • Analytical and problem-solving skills.
  • Keen interest in semiconductor engineering.
  • Strong analytical, logical, and critical-thinking skills.
  • Ability to communicate effectively and collaborate across all levels.
  • Growth mindset with a passion for continuous learning.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and business outcomes.

Responsibilities

  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
  • Identify, test, and share AI-enablement enhancements within one scope of work to support continuous improvement.
  • Execute assembly processes to support first New Product Introduction (NPI) success and smooth transfer from NPI to High Volume Manufacturing (HVM).
  • Execute qualification of NPI products and packages derived from pilot products and packages according to the planned timeline.
  • Support NPI business processes through Technical Risk Assessment (TRA), Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), Quality Control Plan (QCP), risk mitigation, and documentation.
  • Deliver best-in-class yield and cost on NPI products by integrating Design for Manufacturing (DFM) package solutions, process guidelines, and design rules.
  • Collaborate with cross-functional teams on NPI-to-HVM process transfer.
  • Execute NPI customer sample and engineering sample builds on time for new products and packages.
  • Perform timely detection and data analysis for process yield improvement; lead defect elimination and continuous improvement actions using problem-solving methodologies, statistical analysis, and integrated solution decisions.
  • Develop process recipes to achieve best-in-class Units Per Hour (UPH) and conduct process characterization to define process parameters and boundaries.
  • Develop in-depth assembly process technical knowledge, understand process capability, tolerance, and specification limits, and use FMEA, QCP, and machine alarms in assembly process characterization, development, and NPI.
  • Lead global cross-team collaboration on network Best Known Methods (BKM), process recipe specifications, and recipe standardization or conversion.
  • Participate in and support the product roadmap to enable key process capabilities and technology development and ensure packaging solutions are ready before the first qualified silicon delivery.
  • Engage frequently with equipment and material suppliers, at least monthly and daily or weekly for process issues.
  • Collaborate with suppliers and participate in supplier roadmaps for materials and equipment to understand market trends and competitors' direction and ensure process technology and capabilities are enabled in line with those roadmaps.
  • Review and participate in competitor analysis to understand market trends and competitors' technology and capability boundaries.

Desired Qualifications

  • Fresh graduates with a strong passion for semiconductor engineering are encouraged to apply; students holding leadership roles in academic or sports councils have an added advantage.
  • Internship or experience in the semiconductor industry.
  • Demonstrated leadership and a track record of impact.
  • Interest in and knowledge of the semiconductor industry and Micron.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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