Test Solutions Engineer

JOB DESCRIPTION

As a High Bandwidth Memory Test Engineer at Micron, you will develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Micron Test Engineers support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. In this position, you will constantly learn new device specifications and operations in order to develop efficient and innovative solutions of production test flows thru test algo optimization. Additionally, you will take responsibility to gain a firm understanding of the functionality of advanced memory devices as defined in product data sheets.

RESPONSIBILITIES AND TASKS:

• Independency of development of new tests and test algorithms for HBM, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times.
• Experienced on test programs development for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area.
• Be a lead to new product introduction (NPI) as well as pre/post silicon tasks management.
• Develop test Automation solutions as electrical validation and qualification of new test equipment and tools.
• Independently debug and identify root causes on test issues and provide solutions across internal/external groups.
• Provide meaningful statistical data analysis, analytics and justification on program validation and its release to ensure program quality.
• Evaluate and verify yields/quality with global teams to ensure we are shipping the highest quality product to our customers with enforce to all data sheet specification.
• Support both internal and external groups on experiments designed to improve yield or capacity by resolving test issues that impact site in a timely manner.
• Maintain tactical and project updates on daily and weekly basis, respectively. Updates should show progress against the timelines.
• Drive Innovation and Improvement with the end goal of reducing the Cost of Test for Micron in the Test Department.
• Support intra-departmental (and multi-site) teams in development of new processes and capabilities to support product roadmap; lead teams and drive development where necessary.

SUCCESSFUL CANDIDATES for THIS POSITION MUST DEMOSTRATE:

• Experienced with electrical engineering, as applicable to memory devices and test hardware.
• Well know of digital systems and digital logic for DRAM or HBM.
• Strong logical thinking, as applied to general programming and problem solving.
• Experienced with testing logic and leading products/projects. Familiar on cross groups communication.

SKILLS:

• Familiar for problem solving with experienced programming logic.
• Familiar with C/C++, and python for APG programing and test hardware architecture.
• Influent communication with English speaking and ability to work in a multi-national multi-functional team.
• Familiar working on Unix/Linux terminal.
• Familiar semiconductor device knowledge and semiconductor process manufacturing.
• Familiar with HBM product architecture or DRAM operation logic.

AI requirement :

• Demonstrate proficiency in Microsoft Copilot, Open Code/GitHub Copilot, and AI-enabled engineering tools.

• Drive AI adoption to improve engineering productivity, automate repetitive tasks, and accelerate decision-making.