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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Engineer - High HBM, PE Design Validation

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listed

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical & Electronics Engineering or a related field, or equivalent experience.
  • At least 5 years of relevant experience in Design Validation, Product Engineering, or related disciplines.
  • Strong knowledge of Memory Architecture (DRAM, LPDDR, HBM preferred), VLSI, semiconductor process, and device physics.
  • Exposure to schematic, simulation, data analysis, lab debug, or pattern manipulation.
  • Experience with Verilog, VHDL, or SystemVerilog.
  • Ability to work effectively in team-based projects, contributing to shared goals and outcomes.

Responsibilities

  • Lead technical discussions and serve as a key interface between Design, Manufacturing, Test, and Quality internal departments and external customers; collaborate with PE teams and drive issue prioritization, alignment, and closure across organizations throughout the product lifecycle.
  • Define and execute validation plans for HBM products, including design validation and test mode validation, using simulation, data analysis, and ATE/bench analysis; develop methodologies to ensure product robustness, manufacturability, and customer readiness.
  • Lead root cause investigations for silicon, manufacturing, test, quality, and customer issues using hardware debugging, circuit simulation, statistical analysis, and failure analysis techniques.
  • Drive initiatives to improve validation coverage, test efficiency, debug turnaround time, and product quality; challenge existing methodologies and introduce new approaches aligned with business objectives.
  • Use statistical analysis and data mining to identify trends, assess risks, improve validation coverage, and accelerate issue resolution; develop automated data analysis solutions to improve engineering productivity and decision making.
  • Develop a deep understanding of HBM architecture, JEDEC specifications, memory subsystems, and test methodologies.
  • Identify, test, and share AI-enabled enhancements within the scope of work.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.

Desired Qualifications

  • Knowledge of HBM memory architecture is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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