Soitec

Engineered substrates for silicon-on-insulator wafers

MTBE Process Technician

Inspection & Test +1Updated on Nov 10

Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

Understanding of statistical process control (SPC) and its applications in semiconductor equipment and processes.
Direct experience in metrology (defectivity, thickness, or geometry), sorting and packaging, and a characterization lab is advantageous.
Strong verbal and written communication, personal-computer skills, presentation skills, and data collection and analysis skills.
Willingness to work any shift.
Ability to troubleshoot problems and address root causes.
Teamwork, multitasking, and project-leading capabilities.

Responsibilities

Monitor and analyze metrology and backend (MTBE) tools that are out of control under established SPC rules for process and defect-related issues, and decide how to address them.
Use standard operating procedures (SOPs) to dispose of products that were out of control under established SPC rules for process and defect-related issues.
Compile daily presentation materials on process and tool issues and present them at the passdown meeting.
Carry out process-engineering tasks assigned by process engineers that contribute directly to process and flexibility improvements.
Perform basic metrology-tool tuning.
Create equipment recipes when required.
Assume additional responsibilities as needed.

Desired Qualifications

Direct experience in metrology (defectivity, thickness, or geometry), sorting and packaging, and a characterization lab.

Introduce Soitec and context of the position

How does something you do not see improve your daily life? This is what our products do and they are in your smartphones, cars, and connected objects. They make them more efficient and less energy intensive. We are passionate about innovation in technology and proud of the value we create for our customers. At Soitec, we are also in a state of transformation: cultural, managerial and digital. We want to make our company an organization where freedom of action and accountability guide our actions. Do you want to change things or test a new idea? If so, what are you waiting for? It is time to come to Soitec!

What does the job consist?

Monitor, analyze and make decisions on how to address MTBE (Metrology and Backend) tools that are out of control for established SPC rules for both process and defect related issues.
Use SOP to dispose of products that were out of control for established SPC rules for both process and defect related issues.
Perform daily compilation of presentation materials on daily process and tools issues and present in Passdown meeting
Carry out and complete process engineering tasks assigned by process engineers which directly contributed to process improvement and flexibility improvement.
Required to perform basic metrology tool tuning.
May be required to perform equipment recipe creation.
Take the initiative to assume added responsibilities.

Requirements & qualifications

Understanding of SPC and its applications in semiconductor equipment and processes.
Direct experience in metrology (Defectivity/Thickness/Geometry), Sorting and packaging, and Characterization lab are plus points.
Excellent verbal and written communication, good PC skills, presentation skills and strong data collection and analysis skills.
Willing to work any shift and that you be a behavioral example by being a proactive problem solver, communicating openly, and taking responsibility.
Possess good teamwork, multi-tasking capabilities and project leading skills.
Self-motivated
Ability to troubleshoot problems and address root causes
Team oriented with a strong focus on effective team dynamics

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Bernin, France
Founded: 1992

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