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Besxar

In-space fabrication of semiconductor substrates

Senior Electrical Design Engineer

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeWashington, DC, USA$175k - $225k

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Engineering, Physics, or a similar technical discipline, or equivalent practical experience.
  • At least 8 years of progressive electrical design engineering experience developing complex hardware products from concept through build, integration, and test.
  • Demonstrated ownership of large ECAD assemblies and electrical product development for highly integrated spacecraft, aerospace, defense, semiconductor or process equipment, or other high-consequence systems.
  • Strong proficiency with a modern ECAD platform such as Altium Designer, Cadence Allegro or OrCAD, Xpedition, or a similar platform, and released documentation packages including schematics, PCB layout, fabrication and assembly documentation, revision control, and PDM/PLM workflows.
  • Strong electrical design fundamentals, including analog and mixed-signal design, power electronics, grounding and shielding, component selection, radiation protection schemes, interface definition, and hardware verification.
  • Hands-on build and assembly experience, with the ability to work directly with hardware in a lab, on the floor, or with suppliers to debug interfaces, resolve issues, and improve designs.
  • Experience designing, integrating, or qualifying high-reliability electronics using space-rated, radiation-tolerant, or rad-hard components.
  • Experience with lab equipment and development testing of electronic assemblies and subsystems, including oscilloscopes, logic analyzers, power supplies, waveform generators, DAQ systems, and other instrumentation used for characterization, troubleshooting, and validation.
  • Ability to apply lessons learned from previous designs, build issues, and test outcomes to improve robustness, manufacturability, and development speed.
  • Strong written and verbal communication skills, including documenting assumptions, presenting at design reviews, and driving cross-functional alignment.
  • Ability to operate as a self-starter in ambiguously defined environments, define requirements, challenge assumptions, make sound tradeoffs, and deliver without heavy oversight.
  • Experience developing spacecraft, satellite, launch, RF, or other hardware intended for vacuum, thermal, vibration, shock, and radiation environments.
  • Experience with high-power converters, power distribution architectures, load switching and protection, and dense electromechanical integration for constrained platforms.
  • Experience with RF hardware, communications links, high-frequency interconnect, or mixed-signal signal chains requiring careful layout, isolation, and test discipline.
  • Experience with processors, FPGAs, memory, ADCs/DACs, sensor interfaces, and digital communications buses such as SPI, I2C, CAN, Ethernet, and RS422, or similar.
  • Experience developing HITL systems, automated test infrastructure, or qualification setups; proficiency writing scripts for test automation, data collection, and analysis in Python, MATLAB, or similar.
  • Experience selecting components for radiation environments and applying derating, worst-case analysis, FMEA, SEE/TID tradeoffs, or similar reliability methods.
  • Experience with EMI/EMC-aware design, grounding and shielding strategy, and diagnosing test exceedances through resolution.
  • Experience supporting environmental or qualification testing, including thermal vacuum, vibration, shock, EMI/EMC, and end-to-end integrated system tests.
  • Willingness to work extended hours or weekends as needed around test campaigns, flight readiness, and major customer milestones.
  • Ability to travel for short and extended trips as needed.
  • Eligibility to access export-controlled information as a U.S. citizen or national, lawful permanent resident, refugee, or asylee, or ability to obtain the required U.S. Department of State authorizations.

Responsibilities

  • Lead electrical design and research and development for Besxar Fabships, including architecture development, trade studies, detailed design, and integration strategy across power electronics, avionics, RF subsystems, instrumentation, DAQ, test interfaces, and supporting ground hardware.
  • Own major ECAD assemblies and electrical product structure/BOM for critical systems; maintain configuration discipline, clear interfaces, robust libraries, and release packages for schematics, layouts, fabrication notes, assembly documentation, and released design data.
  • Translate system requirements into manufacturable, testable, high-reliability electrical designs balancing performance, mass, power, thermal behavior, radiation tolerance, EMI/EMC, fault protection, serviceability, cost, and schedule.
  • Drive the hardware life cycle from concept through component selection, schematic capture, PCB layout and layout direction or review, prototype builds, board bring-up, verification, qualification, vehicle integration, and flight or mission feedback.
  • Design and analyze circuits and assemblies for high-power electronics, power conversion and distribution, mixed-signal interfaces, RF signal chains, spacecraft instrumentation, DAQ systems, and sensor and actuator interfaces using space-rated and radiation-tolerant or rad-hard components where appropriate.
  • Lead hands-on assembly, lab bring-up, and integration of PCBAs, harnesses, enclosures, and test setups.
  • Create or review board bring-up test plans and procedures, work instructions, associated documentation, higher-level test plans, functional test procedures, assembly work instructions and procedures, and environmental test-limit definitions.
  • Lead development of post-launch inspection criteria, checkout flows, and test plans for repeated flight operations.
  • Develop HITL and bench test capabilities to validate subsystem behavior, characterize performance, close requirements, and accelerate debugging across development and integration.
  • Perform and review electrical analyses to close designs with appropriate engineering margin, including worst-case and derating analysis, grounding and isolation, EMI/EMC, radiation and environmental considerations, and failure modes and risk assessments.
  • Use prior design experience, integration results, supplier issues, operational unit behavior during environmental testing and on-orbit operation, and failure investigations to improve hardware revisions and avoid repeated mistakes.
  • Partner with technicians, manufacturing, supply chain, and external vendors to move assemblies from design through fabrication, inspection, PCBA assembly, rework, verification, integration, and environmental testing.
  • Lead or contribute to design reviews, root-cause investigations, anomaly resolution, and configuration changes.
  • Help define electrical engineering practices, including ECAD conventions, library management, design checklists, release processes, test standards, and cross-functional review norms.
  • Mentor other engineers and contribute technical leadership as the electrical team grows.

Desired Qualifications

  • Experience applying DFM/DFA/DFT principles to optimize product designs, reduce production costs, improve assembly efficiency, and ensure robust testable hardware throughout the product life cycle.
  • Track record of end-to-end ownership from architecture through test and iteration on complex hardware programs.
  • Experience in early-stage or high-growth environments where speed, pragmatism, and sound judgment matter.
  • Experience mentoring engineers or technicians and helping set standards for a growing hardware team.
  • Experience supporting export-controlled or ITAR-sensitive hardware development environments.

About the Company

Besxar

In-space fabrication of semiconductor substrates

Besxar builds reusable orbital Fabships that manufacture ultra-pure semiconductor substrates in space vacuum to supply power and AI chips without Earth-side clean rooms. Small microwave-sized Fabships attach to Falcon 9 boosters, expose wafers in orbit, and return with the booster, with in-orbit processing including heating and multi-material deposition to produce qualification wafers. The approach leverages in-space fabrication on launch-vehicle‑attached Fabships and early data from orbital samples, supported by a SpaceX deal for 24 Fabship payloads and investors backing the effort, positioning it to scale toward larger, Starship-class fabs. The goal is to continuously produce substrates for data-center, robotics, and EV power chips via on-orbit manufacturing.

Company size
11-50
Company stage
Seed
Total funding
$9.4M
Headquarters
Washington DC, United States
Founded
2023

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